Controlling the thermal contact resistance of a carbon nanotube heat spreader

Applied Physics Letters

Volumn 97, Issue 6, 2010, Pages

  Baloch, Kamal H ^a   Voskanian, Norvik ^a   Cumings, John ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT IMAGING; FABRICATION TECHNIQUE; HEAT SPREADERS; IN-SITU; MECHANICAL SUPPORT; METAL CONTACTS; THERMAL CONTACT RESISTANCE; THERMAL COUPLING; THERMAL MANAGEMENT; THERMAL MICROSCOPY; THERMAL RESISTANCE;

CARBON NANOTUBES; CONTACT RESISTANCE; THERMAL CONDUCTIVITY OF SOLIDS;

HEAT RESISTANCE;

EID: 77955732789     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3478212     Document Type: Article

References (34)

1. J. Hone, B. Batlogg, Z. Benes, A. T. Johnson, and J. E. Fischer, Science SCIEAS 0036-8075 289, 1730 (2000). 10.1126/science.289.5485.1730
2. P. Kim, L. Shi, A. Majumdar, and P. L. McEuen, Phys. Rev. Lett. PRLTAO 0031-9007 87, 215502 (2001). 10.1103/PhysRevLett.87.215502
3. M. J. Biercuk, M. C. Llaguno, M. Radosavljevic, J. K. Hyun, A. T. Johnson, and J. E. Fischer, Appl. Phys. Lett. APPLAB 0003-6951 80, 2767 (2002). 10.1063/1.1469696 (Pubitemid 34573551)
4. J. Hone, M. C. Llaguno, M. J. Biercuk, A. T. Johnson, B. Batlogg, Z. Benes, and J. E. Fischer, Appl. Phys. A: Mater. Sci. Process. APAMFC 0947-8396 74, 339 (2002). 10.1007/s003390201277 (Pubitemid 34268681)
5. S. Berber, Y. K. Kwon, and D. Tomanek, Phys. Rev. Lett. PRLTAO 0031-9007 84, 4613 (2000). 10.1103/PhysRevLett.84.4613
6. E. Pop, D. Mann, Q. Wang, K. Goodson, and H. J. Dai, Nano Lett. NALEFD 1530-6984 6, 96 (2006). 10.1021/nl052145f (Pubitemid 43166108)
7. S. Maruyama, Physica B PHYBE3 0921-4526 323, 193 (2002). 10.1016/S0921-4526(02)00898-0 (Pubitemid 35019027)
8. D. J. Yang, Q. Zhang, G. Chen, S. F. Yoon, J. Ahn, S. G. Wang, Q. Zhou, Q. Wang, and J. Q. Li, Phys. Rev. B PLRBAQ 0556-2805 66, 165440 (2002). 10.1103/PhysRevB.66.165440
9. T. Y. Choi, D. Poulikakos, J. Tharian, and U. Sennhauser, Nano Lett. NALEFD 1530-6984 6, 1589 (2006). 10.1021/nl060331v (Pubitemid 44327515)
10. M. Fujii, X. Zhang, H. Q. Xie, H. Ago, K. Takahashi, T. Ikuta, H. Abe, and T. Shimizu, Phys. Rev. Lett. PRLTAO 0031-9007 95, 065502 (2005). 10.1103/PhysRevLett.95.065502 (Pubitemid 41506068)
11. C. H. Yu, L. Shi, Z. Yao, D. Y. Li, and A. Majumdar, Nano Lett. NALEFD 1530-6984 5, 1842 (2005). 10.1021/nl051044e (Pubitemid 41396175)
12. J. P. Small, K. M. Perez, and P. Kim, Phys. Rev. Lett. PRLTAO 0031-9007 91, 256801 (2003). 10.1103/PhysRevLett.91.256801
13. I. K. Hsu, R. Kumar, A. Bushmaker, S. B. Cronin, M. T. Pettes, L. Shi, T. Brintlinger, M. S. Fuhrer, and J. Cumings, Appl. Phys. Lett. APPLAB 0003-6951 92, 063119 (2008). 10.1063/1.2829864 (Pubitemid 351263861)
14. L. Shi, Appl. Phys. Lett. APPLAB 0003-6951 92, 206103 (2008). 10.1063/1.2908172 (Pubitemid 351756442)
15. H. Maune, H. Y. Chiu, and M. Bockrath, Appl. Phys. Lett. APPLAB 0003-6951 89, 013109 (2006). 10.1063/1.2219095 (Pubitemid 44025442)
16. C. H. Yu, S. K. Saha, J. H. Zhou, L. Shi, A. M. Cassell, B. A. Cruden, Q. Ngo, and J. Li, ASME Trans. J. Heat Transfer JHTRAO 0022-1481 128, 234 (2006). 10.1115/1.2150833
17. A. W. Tsen, L. A. K. Donev, H. Kurt, L. H. Herman, and J. Park, Nat. Nanotechnol. NNAABX 1748-3387 4, 108 (2009). 10.1038/nnano.2008.363
18. E. Pop, D. A. Mann, K. E. Goodson, and H. Dai, J. Appl. Phys. JAPIAU 0021-8979 101, 093710 (2007). 10.1063/1.2717855 (Pubitemid 46753073)
19. P. Kim, L. Shi, A. Majumdar, and P. L. McEuen, Physica B PHYBE3 0921-4526 323, 67 (2002). 10.1016/S0921-4526(02)00969-9 (Pubitemid 35018993)
20. L. Shi, J. Zhuo, P. Kim, A. Batchtold, A. Majumdar, and P. L. McEuen, J. Appl. Phys. JAPIAU 0021-8979 105, 104306 (2009). 10.1063/1.3126708
21. M. T. Pettes and L. Shi, Adv. Funct. Mater. AFMDC6 1616-301X 19, 3918 (2009). 10.1002/adfm.200900932
22. R. S. Prasher, X. J. Hu, Y. Chalopin, N. Mingo, K. Lofgreen, S. Volz, F. Cleri, and P. Keblinski, Phys. Rev. Lett. PRLTAO 0031-9007 102, 105901 (2009). 10.1103/PhysRevLett.102.105901
23. B. Li, L. Wang, and G. Casati, Phys. Rev. Lett. PRLTAO 0031-9007 93, 184301 (2004). 10.1103/PhysRevLett.93.184301
24. B. Li, L. Wang, and G. Casati, Appl. Phys. Lett. APPLAB 0003-6951 88, 143501 (2006). 10.1063/1.2191730
25. T. Brintlinger, Y. Qi, K. H. Baloch, D. Goldhaber-Gordon, and J. Cumings, Nano Lett. NALEFD 1530-6984 8, 582 (2008). 10.1021/nl0729375 (Pubitemid 351346021)
26. x membranes obtained from Silson Inc.
27. M. F. Yu, O. Lourie, M. J. Dyer, K. Moloni, T. F. Kelly, and R. S. Rouff, Science SCIEAS 0036-8075 287, 637 (2000). 10.1126/science.287.5453.637 (Pubitemid 30070908)
28. H. Dai, J. H. Hafner, A. G. Rinzler, D. T. Colbert, and R. E. Smalley, Nature (London) NATUAS 0028-0836 384, 147 (1996). 10.1038/384147a0 (Pubitemid 26386465)
29. S. Shen, A. Narayanaswamy, and G. Chen. Nano Lett. NALEFD 1530-6984 9, 2909, (2009). 10.1021/nl901208v
30. N. G. Chopra, L. X. Benedict, V. H. Crespi, M. L. Cohen, S. G. Louie, and A. Zettl, Nature (London) NATUAS 0028-0836 377, 135 (1995). 10.1038/377135a0
31. G. E. Begtrup, K. K. Ray, B. M. Kessler, T. D. Yuzvinsky, H. Garcia, and A. Zettl, Phys. Rev. Lett. PRLTAO 0031-9007 99, 155901 (2007). 10.1103/PhysRevLett.99.155901 (Pubitemid 47575119)
32. See supplementary material at http://dx.doi.org/10.1063/1.3478212 E-APPLAB-97-064032 for details of sample preparation, modeling and methods to obtain melting voltages.
33. T. Hertel, R. E. Walkup, and P. Avouris, Phys. Rev. B PLRBAQ 0556-2805 58, 13870 (1998). 10.1103/PhysRevB.58.13870
34. M. S. Purewal, B. H. Hong, A. Ravi, B. Chandra, J. Hone, and P. Kim, Phys. Rev. Lett. PRLTAO 0031-9007 98, 186808 (2007). 10.1103/PhysRevLett.98. 186808 (Pubitemid 46701719)