A novel stopband-enhanced EBG planes using an embedded slow-wave structure in low-cost RF-SiP

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2008, Pages 131-134

  Hsieh, Chia Yuan ^a   Chuang, Hao Hsiang ^a   Wang, Ting Kuang ^a   Wang, Chen Chao ^b   Cheng, Hung Hsiang ^b   Wu, Yei Shen ^b   Chiu, Chi Tsung ^b   Hung, Chih Pin ^b   Wu, Tzong Lin ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

EBG; Power integrity; RF SiR

Indexed keywords

AUDIO FREQUENCY AMPLIFIERS; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; INTERNET PROTOCOLS; LOW NOISE AMPLIFIERS;

COST DESIGNS; DIGITAL DRIVERS; EBG; GROUND PLANES; GROUND SURFACES; POWER INTEGRITY; POWER PLANES; RF-SIR; SLOW WAVES; STOP BANDS; TEST CHIPS; TEST SAMPLES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 58049130674     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2008.4675895     Document Type: Conference Paper

References (5)

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2. R. Abhari, and G V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microwave Theory and Tech., vol. 51, pp. 1629-1639, June 2003.
3. T. L. Wu, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, "Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression of Ground Bounce Noise and Radiated Emission in High-Speed Circuits", IEEE Trans. Microwave Theory and Tech., vol. 53, No.9, pp. 2935-2942, Sept. 2005.
4. T. K. Wang, T. W. Han, and T. L. Wu, "A novel EBG power plane with stopband enhancement using artificial substrate," IEEE Trans. Microwave Theory and Tech, vol. 56, No.5, pp. 1164-1171, Sept. 2008.
5. K. H. Kim, and J. E. Schutt-Aine, "Analysis and Modeling of Hybrid Planar-Type Electromagnetic-Bandgap Structures and Feasibility Study on Power Distribution Network Applications," IEEE Trans. Microwave Theory and Tech, vol. 56, No.1, pp. 178-186, Jan. 2008