Effect of organic additives on copper dissolution for e-CMP

Microelectronic Engineering

Volumn 87, Issue 11, 2010, Pages 2187-2189

  Cojocaru, P ^a   Muscolino, F ^a   Magagnin, L ^a  

^a POLITECNICO DI MILANO   (Italy)

Author keywords

Additives; BTA; Copper; e CMP; PTA

Indexed keywords

BENZOTRIAZOLES; BTA; CMP PROCESS; COPPER DISSOLUTION; ELECTRONIC INDUSTRIES; FUTURE APPLICATIONS; ORGANIC ADDITIVES; PLANARIZATION; POROUS LOW-K DIELECTRICS; TETRAZOLES;

ADDITIVES; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; COPPER; DISSOLUTION; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES;

DIELECTRIC MATERIALS;

EID: 77955513483     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.01.023     Document Type: Article

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