Impact of plasma etching on fabrication technology of liquid crystal polymer printed circuit board

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 9, 2010, Pages 954-962

  Yung, K C ^a   Liem, H ^a   Choy, H S ^a   Yue, T M ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION IMPROVEMENT; CHEMICAL INERTNESS; DIFFERENT PROCESS; FABRICATION TECHNOLOGIES; HIGH FREQUENCY; LOW LOSS; METALLIZATION PROCESS; PROCESS APPROACH; SUBSTRATE MATERIAL; SURFACE ACTIVATION; THEORETICAL STUDY; THERMAL STABILITY; TREATMENT CONDITIONS;

CHEMICAL RESISTANCE; CHEMICAL STABILITY; FABRICATION; LIQUID CRYSTALS; METAL CLADDING; PLASMA ETCHING; PLASMAS; PRINTED CIRCUIT MANUFACTURE;

PRINTED CIRCUIT BOARDS;

EID: 77955469546     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-0024-z     Document Type: Article

References (33)

1. LD Thomas DD Roth 1990 Chemtech 20 546 555 1:CAS:528:DyaK3MXhvVKltbw%3D
2. G. Zou, H. Gronqvist, P. Starski, J. Liu, in Proceedings of IEEE 8th International Advanced Packaging Materials Symposium (2002), pp. 337-341
3. S. Corbett, J. Strole, B. Ross, P. Jordan, J. Ketterl, T. Hughes, in Proceedings of IMAPS on Microelectronics, Boston, MA, USA (2000), pp. 212-216
4. DC Thompson O Tantot H Jallageas GE Ponchak M Tentzeris J Papapolymerou 2004 IEEE Trans. Microw. Theo. Tech. 52 1343 1352 10.1109/TMTT.2004.825738 1:CAS:528:DC%2BD2cXktFOlsrs%3D 2004ITMTT..52.1343T
5. T. Noll, K. Jayaraj, B. Farrell, R. Larmouth, in Proceedings of International Conference on Multichip Modules, Denver, Colorado (1996), pp. 1-6, available: http://www.tetpct.com/pdffiles/ Low%20Cost%20MCM%20&%20LCP%20Dielectrics.pdf
6. JL Shohet 1991 IEEE Trans. Plasma Sci. 19 725 733 10.1109/27.108405 1:CAS:528:DyaK38XhtFWks7g%3D 1991ITPS...19..725S
7. HM Powell JJ Lannutti 2003 Langmuir 19 9071 9078 10.1021/la0349368 1:CAS:528:DC%2BD3sXnt1CjsL8%3D
8. M. Beulque, C. Roseen, B. Van Laere, M. Laureys, Liquid crystalline polymer: a breakthrough. OnBoard Technol. (2003), available: http://www.wisemedia.it/ob/ob/postnuke/pdf/settembre/090306.pdf
9. MMR Howlader M Iwashita K Nanbu K Saijo T Suga 2005 IEEE Trans. Adv. Packaging 28 495 502 10.1109/TADVP.2005.848522 1:CAS:528:DC%2BD2MXpvFart7s%3D (Pubitemid 41263755)
10. MMR Howlader T Suga A Takahashi 2005 J. Mater. Sci. 40 3177 3184 10.1007/s10853-005-2681-5 1:CAS:528:DC%2BD2MXltlKgu74%3D 2005JMatS..40.3177H (Pubitemid 40834140)
11. A.T. Ananthakrishnan, Frost, Sullivan, in Flexible Circuits Market: Surging Ahead (2008), available: http://smt.pennnet.com/display-article/323443/ 35/ARTCL/none/none/1/Flexible-Circuits-Market:-Surging-Ahead/
12. Y Kurihara H Ohata M Kawaguchi S Yamazaki K Kimura 2008 J. Appl. Polym. Sci. 108 85 92 10.1002/app.27537 1:CAS:528:DC%2BD1cXisFylsrs%3D (Pubitemid 351363266)
13. Q. Zhang, L. Nyborg, U. Jelvestam, Z. Lai, Z. Cheng, J. Liu, in Proceedings of IEEE International Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (2005), pp. 1-6
14. B Wang W Eberhardt H Kuck 2005 J. Mater. Sci. 40 3535 3538 10.1007/s10853-005-2936-1 1:CAS:528:DC%2BD2MXmt1Wnurg%3D 2005JMatS..40.3535W (Pubitemid 41130180)
15. G. Brist, G.G. Long, Advanced Print Circuit Board Materials. Materials for Advanced Packaging (Springer, New York, LLC, 2008)
16. RH Hansen JV Pascale T Debenedictis PM Rentzepis 1965 J. Polym. Sci. A 3 2205 2214 1:CAS:528:DyaF2MXktlaisLw%3D
17. JR Hall CAL Westerdahl AT Devine MJ Bodnar 1969 J. Appl. Polym. Sci. 13 2085 2096 10.1002/app.1969.070131006 1:CAS:528:DyaF1MXlt1Gmur8%3D
18. E.M. Liston, P.W. Rose, in Proceedings of 7th International Symposium on Plasma Chemistry, Netherlands, vol. 2 (1985), pp. 219-224
19. X. Wang, L. Lu, C. Liu, in Proceedings of IEEE International MEMS Conference (2001), pp. 21-25
20. N Vandencasteele D Merche F Reniers 2006 Surf. Interf. Anal. 38 526 530 10.1002/sia.2255 1:CAS:528:DC%2BD28XkvVCisb0%3D
21. TH Lin M Belser Y Tzeng 1988 IEEE Trans. Plasma Sci. 16 631 637 10.1109/27.16551 1:CAS:528:DyaL1MXhtVKhu70%3D 1988ITPS...16..631L
22. A. Paproth, K.J. Wolter, T. Herzog, T. Zerna, in Proceedings of 24th International Spring Seminar Electronics Technology, Romania (2001), pp. 37-41
23. J Ge K Turnuen JK Kivilahti 2008 J. Appl. Polym. Sci. 108 85 92 10.1002/app.27286 (Pubitemid 351413027)
24. T. Suga, A. Takahashi, M. Howlander, K. Saijo, S. Oosawa, in Proceedings of 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (2002), pp. 177-182
25. L. Fierro, I.D. Getty, in Plasma Processes for Printed Circuit Board Manufacturing (2002) [Online], available: http://www.quasys.ch/doc-download/ CircuitreeArticle.pdf
26. KC Yung J Wang SQ Huang CP Lee TM Yue 2006 Mater. Manuf. Process. 21 899 906 10.1080/10426910600837798 1:CAS:528:DC%2BD28Xht1yksLzE (Pubitemid 44664148)
27. C. Li, in Innerlayer Copper Reliability of Electroless Copper Processes. Electronic Materials Asia (2008) [Online], available: http://www.pcb007.com/ pages/zone.cgi?a=45534&-pf-=1
28. V.S. Voitsenya, S. Masuzaki, O. Motojima, A. Sagara, W. Jacob, in Proceedings of Problems of Atomic Science and Technology: No. 6. Series, Plasma Physics, vol. 12 (2006), pp. 141-143
29. M Manca B Cortese I Viola AS Arico R Cingolani G Gigli 2008 Langmuir 24 1833 1843 10.1021/la703077u 1:CAS:528:DC%2BD1cXlsl2jug%3D%3D 18193908 (Pubitemid 351500939)
30. I Woodward WCE Schofield V Roucoules JPS Badyal 2003 Langmuir 19 3432 3438 10.1021/la020427e 1:CAS:528:DC%2BD3sXitFGntLk%3D
31. LJ Matienzo FD Egitto 1995 Solid State Technol. 38 99 106
32. K Nanbu S Ozawa K Yoshida K Saijo 2005 IEEE Trans. Compon. Pack. Technol. 28 760 764 10.1109/TCAPT.2005.859746 1:CAS:528:DC%2BD28Xhs12gtQ%3D%3D (Pubitemid 41825217)
33. C Seidel C Damm H Muenstedt J Adhes 2007 Sci. Technol. 21 423 439 1:CAS:528:DC%2BD2sXmsFensr0%3D