Modeling the etching rate and uniformity of plasma-aided manufacturing using statistical experimental design

Materials and Manufacturing Processes

Volumn 21, Issue 8, 2006, Pages 899-906

  Yung, K C ^a   Wang, J ^a   Huang, S Q ^a   Lee, C P ^a   Yue, T M ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Design of experiments; Etch rate; Plasma; Uniformity

Indexed keywords

ETCHING; ION BOMBARDMENT; MULTILAYERS; PRINTED CIRCUIT BOARDS; SCREENING; STATISTICAL METHODS;

DESIGN OF EXPERIMENTS; ETCH RATE; SCREENING FACTORIAL EXPERIMENTS; UNIFORMITY;

PLASMA APPLICATIONS;

EID: 33750505403     PISSN: 10426914     EISSN: 15322475     Source Type: Journal    
DOI: 10.1080/10426910600837798     Document Type: Article

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