Surface modification of films of various high temperature resistant thermoplastics

Journal of Adhesion Science and Technology

Volumn 21, Issue 5-6, 2007, Pages 423-439

  Seidel, C ^a,b   Damm, C ^a   Muenstedt, H ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^b SIEMENS AG   (Germany)

Author keywords

Adhesion; Copper foil; Liquid crystal polymer; Photoelectron spectroscopy; Poly(etheretherketone); Poly(phenylenesulfide); Surface modification

Indexed keywords

BOND STRENGTH (MATERIALS); LIQUID CRYSTALS; SURFACE PROPERTIES; SURFACE TREATMENT;

COPPER FOIL; POLYETHERETHERKETONE; POLYPHENYLENESULFIDE;

THERMOPLASTICS;

EID: 34848837647     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856107780474966     Document Type: Article

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