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Volumn 49, Issue 6 PART 2, 2010, Pages

Resist properties of thin poly(methyl methacrylate) and polystyrene films patterned by thermal nanoimprint lithography for au electrodeposition

(3) Nagase, Koichi a Kubo, Shoichi a Nakagawa, Masaru a

a TOHOKU UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AU THIN FILMS; ELECTRODE SURFACES; LINE PATTERN; LINEWIDTH ROUGHNESS; POLYMER PATTERNS; POLYSTYRENE FILMS; RESIDUAL LAYERS; SILICON SUBSTRATES; SIZE ACCURACY; THERMAL NANOIMPRINT LITHOGRAPHY; WATER ABSORBABILITY;

ELECTRODEPOSITION; ESTERS; GOLD; GOLD DEPOSITS; LINEWIDTH; NANOIMPRINT LITHOGRAPHY; OXYGEN; POLYACRYLATES; POLYMERS; POLYSTYRENES; SEMICONDUCTING SILICON COMPOUNDS; THIN FILMS;

GOLD COATINGS;

EID: 77955341670 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.49.06GL05 Document Type: Article

Times cited : (10)

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