Evaluation of mechanical characteristics of the plate-type polymer hyperfine pit pattern by the nanoindentation process

International Journal of Precision Engineering and Manufacturing

Volumn 11, Issue 3, 2010, Pages 461-468

  Lee, Eun Kyung ^a   Kang, Chung Gil ^a   Lee, Sang Mae ^a  

^a Pusan National University   (South Korea)

Author keywords

AFM; Elastic modulus; Hardness; Nanoindenter; Plate type polymer; Polycarbonate(PC); Polymethylmetacrylate(PMMA); Thermal nanoindentation

Indexed keywords

EID: 77955233459     PISSN: 12298557     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12541-010-0053-9     Document Type: Article

References (15)

1. Hardt, D., Ganesan, B., Oi, W., Dirckx, M. and Rzepniewski, A., "Process Control in Micro-Embossing: A Review," Singapore MIT Alliance Programme (SMA) in Innovation in Manufacturing Systems and Technology (IMST), 2004.
2. Choi, C. G., "Fabrication of optical waveguides in thermosetting polymers using hot embossing," J. Micromech. Microeng., Vol. 14, No. 7, pp. 945-949, 2004.
3. Kim, W. S., Yoon, K. B. and Bae, B. S., "Nanopatterning of photonic crystals with a photocurable silica-titania organic-inorganic hybrid material by a UV-based nanoimprint technique," J. Mater. Chem., Vol. 15, No. 42, pp. 4535-4539, 2005.
4. Ishihara, K., Fujita, M., Matusubara, I., Asano, T. and Noda, S., "Direct Fabrication of Photonic Crystal on Glass Substrate by Nanoimprint Lithography," Japanese Journal of Applied Physics Part 2, Vol. 45, No. 4-7, pp. L210-L212, 2006.
5. Heidari, B., Maximov, I. and Montelius, L., "Nanoimprint lithography at the 6 in. wafer scale," J. Vac. Sci. Technol. B, Vol. 18, No. 6, pp. 3557-3560, 2000.
6. Cameron, N. S., Roberge, H., Veres, T., Jakeway, S. C. and Crabtree, H. J., "High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction," Lab Chip, Vol. 6, No. 7, pp. 936-941, 2006.
7. Li, X. and Bhushan, B., "Fatigue studies of nanoscale structures for MEMS/NEMS applications using nanoindentation techniques," Surface and Coatings Technology, Vol. 163-164, pp. 521-526, 2003.
8. O'Connell, B. S., Cross, G. L. W., Pethica, J. B. and Oliver, W., "Nanorheology of squeezed polymer films," Proc. Third IEEE Conference on Nanotechnology, Vol. 2, pp. 793-796, 2003.
9. Guo, L. J., "Recent progress in nanoimprint technology and its applications," J. Phys. D: Appl. Phys., Vol. 37, No. 11, pp. 123-141, 2004.
10. Scheer, H. C. and Schulz, H., "A contribution to the flow behaviour of thin polymer films during hot embossing lithography," Microelectronic Eng., Vol. 56, No. 3-4, pp. 311-332, 2001.
11. Yao, D. and Virupaksha, V. L., "Study on Squeezing Flow During Nonisothermal Embossing of Polymer Microstructures," Polymer Eng. and Sci., Vol. 45, No. 5, pp. 652-660, 2005.
12. Park, J. W., Lee, D. W., Kawasegi, N. and Morita, N., "Nanoscale Fabrication in Aqueous Solution using Tribo-Nanolithography," Int. J. Precis. Eng. Manuf., Vol. 7, No. 4, pp. 8-13, 2006.
13. Kang, H. J., Ahn, S. H., Lee, J. S. and Lee, J. H., "Surface Modification of Aluminum by Nitrogen-Ion Implantation," Int. J. Precis. Eng. Manuf., Vol. 7, No. 1, pp. 57-61, 2006.
14. Fischer-Cripps, A. C., "Nanoindentation," Springer-Verlag New York, pp. 74-76, 2002.
15. rd Edition," Oxford University Press, pp. 100-106, 1999.