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Volumn 13, Issue 4, 2010, Pages 42-47
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Advanced testing and prognostics of ball grid array components with a stand-alone monitor IC
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Author keywords
[No Author keywords available]
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Indexed keywords
BALL GRID ARRAY PACKAGES;
BGA PACKAGE;
CONDITION-BASED MAINTENANCE;
DIGITAL ELECTRONICS;
FAULT COVERAGES;
HEALTH MANAGEMENT;
INTERCONNECT DENSITIES;
INTERMITTENCY;
INTERMITTENT FAULT;
JOINT NETWORK;
OTHER APPLICATIONS;
PACKAGE DENSITY;
RELIABILITY-CENTERED MAINTENANCE;
SOLDER BALLS;
SOLDER JOINTS;
STAND -ALONE;
AEROSPACE APPLICATIONS;
BALL GRID ARRAYS;
BUILT-IN SELF TEST;
ELECTRIC FAULT CURRENTS;
ELECTRONICS PACKAGING;
MAINTENANCE;
MILITARY APPLICATIONS;
PACKAGING;
SENSORS;
SPHERES;
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EID: 77955205563
PISSN: 10946969
EISSN: None
Source Type: Journal
DOI: 10.1109/MIM.2010.5521868 Document Type: Article |
Times cited : (7)
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References (6)
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