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Volumn , Issue , 2007, Pages 40-49

Intermittency detection and mitigation in Ball Grid Array (BGA) packages

Author keywords

[No Author keywords available]

Indexed keywords

ACCUMULATED FATIGUE DAMAGE; BALL-GRID-ARRAY PACKAGES; I/O PINS; INTEGRATED DIAGNOSTICS; INTERMITTENCY; LONG-LASTING;

EID: 48049117059     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AUTEST.2007.4374200     Document Type: Conference Paper
Times cited : (7)

References (18)
  • 1
    • 43549097875 scopus 로고    scopus 로고
    • In-Situ, Real-Time Detector for Faults in Solder Joints Belonging to Operational, Fully Programmed FPGAs
    • Anaheim, CA, Sep. 18-21
    • J.P. Hofmeister, P. Lall and Russ Graves, "In-Situ, Real-Time Detector for Faults in Solder Joints Belonging to Operational, Fully Programmed FPGAs," Proceedings, IEEE AUTOTESTCON 2006, Anaheim, CA, Sep. 18-21, 2006, pp-237-243.
    • (2006) Proceedings, IEEE AUTOTESTCON 2006 , pp. 237-243
    • Hofmeister, J.P.1    Lall, P.2    Graves, R.3
  • 2
    • 48049099831 scopus 로고    scopus 로고
    • Accelerated Reliability Task IPC-SM-785, SMT Force Group Standard, Product Reliability Committee of the IPC, Published by Analysis Tech., Inc., 2005, www.analysistech.com/event-tech-IPC-SM-785.
    • Accelerated Reliability Task IPC-SM-785, SMT Force Group Standard, Product Reliability Committee of the IPC, Published by Analysis Tech., Inc., 2005, www.analysistech.com/event-tech-IPC-SM-785.
  • 3
  • 4
    • 48049095348 scopus 로고    scopus 로고
    • R. Gannamani, V. Valluri, Sidharth and M-L Zhang, Reliability evaluation of chip scale packages, Advanced Micro Devices, Sunnyvale, CA, in Daisy Chain Samples, Application Note, Spansion, July 2003, pp. 4-9.
    • R. Gannamani, V. Valluri, Sidharth and M-L Zhang, "Reliability evaluation of chip scale packages," Advanced Micro Devices, Sunnyvale, CA, in Daisy Chain Samples, Application Note, Spansion, July 2003, pp. 4-9.
  • 5
    • 48049118950 scopus 로고    scopus 로고
    • Sony Semiconductor Quality and Reliability Handbook, Revised May 2001, http://www.sony.net/products/SC-HP/tec/catalog, 2, pp. 66-67, 4, pp. 120-129.
    • Sony Semiconductor Quality and Reliability Handbook, Revised May 2001, http://www.sony.net/products/SC-HP/tec/catalog, Vol. 2, pp. 66-67, Vol. 4, pp. 120-129.
  • 6
    • 48049114932 scopus 로고    scopus 로고
    • Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages, SEMATECH Technology Transfer #99083813A-XFR, International SEMATECH, 1999, 6.
    • Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages, SEMATECH Technology Transfer #99083813A-XFR, International SEMATECH, 1999, pg. 6.
  • 7
    • 48049121680 scopus 로고    scopus 로고
    • Comparison of Ball Grid Array (BGA) Component and Assembly Level Qualification Tests and Failure Modes, SEMATECH Technology Transfer #00053957A-XFR, International SEMATECH, May 31, 2000, pp. 1-4.
    • Comparison of Ball Grid Array (BGA) Component and Assembly Level Qualification Tests and Failure Modes, SEMATECH Technology Transfer #00053957A-XFR, International SEMATECH, May 31, 2000, pp. 1-4.
  • 10
    • 48049117257 scopus 로고    scopus 로고
    • The Reliability Report, XILINX, xgoogle.xilinx.com, Sep. 1, 2003, pp. 225-229.
    • The Reliability Report, XILINX, xgoogle.xilinx.com, Sep. 1, 2003, pp. 225-229.
  • 14
    • 32844459679 scopus 로고    scopus 로고
    • Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments
    • San Francisco, CA, Paper IPACK2005-73426, pp, July 17-22
    • P. Lall, N. Islam and J. Suhling, "Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments," Proceedings of the ASME InterPACK Conference, San Francisco, CA, Paper IPACK2005-73426, pp. 1-9, July 17-22, 2005.
    • (2005) Proceedings of the ASME InterPACK Conference , pp. 1-9
    • Lall, P.1    Islam, N.2    Suhling, J.3
  • 15
    • 34548779748 scopus 로고    scopus 로고
    • Prognostics and Health Management of Electronic Packaging
    • Accepted for Publication in, Paper Available in Digital Format on IEEE Explore, pp, March
    • P. Lall, M.N. Islam, K. Rahim and J. Suhling, "Prognostics and Health Management of Electronic Packaging," Accepted for Publication in IEEE Transactions on Components and Packaging Technologies, Paper Available in Digital Format on IEEE Explore, pp. 1-12, March 2005.
    • (2005) IEEE Transactions on Components and Packaging Technologies , pp. 1-12
    • Lall, P.1    Islam, M.N.2    Rahim, K.3    Suhling, J.4
  • 17
    • 48049115160 scopus 로고    scopus 로고
    • XILINX Fine-Pitch BGA (FG1156/FGG1156) Package, PK039 (v1.2), June 25, 2004.
    • XILINX Fine-Pitch BGA (FG1156/FGG1156) Package, PK039 (v1.2), June 25, 2004.
  • 18
    • 48049086918 scopus 로고    scopus 로고
    • nd Ed., 1999, pp. II-62 to II-185.
    • nd Ed., 1999, pp. II-62 to II-185.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.