-
1
-
-
10444219851
-
Directive 2002/95/EC/ on the restriction of the use of certain hazardous substances in electrical and electronic equipment
-
European Parliament feb.
-
European Parliament, "Directive 2002/95/EC/ on the restriction of the use of certain hazardous substances in electrical and electronic equipment," Official J. Eur. Union, pp. L37/19-L37/23, Feb. 2003.
-
(2003)
Official J. Eur. Union
-
-
-
2
-
-
10444264785
-
Directive 2002/96/EC on waste of electrical and electronic equipment
-
European Parliament feb.
-
European Parliament, "Directive 2002/96/EC on waste of electrical and electronic equipment," Official J. Eur. Union, pp. L37/24-L37/38, Feb. 2003.
-
(2003)
Official J. Eur. Union
-
-
-
3
-
-
0032090243
-
Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art
-
Jun.
-
J. C. Jagt, "Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art," IEEE Trans. Compon., Packag., Manuf. Technol. A, vol. 21, pt. A, no. 2, pp. 215-225, Jun. 1998.
-
(1998)
IEEE Trans. Compon., Packag., Manuf. Technol. A
, vol.21
, Issue.2 PART A
, pp. 215-225
-
-
Jagt, J.C.1
-
4
-
-
84889274930
-
-
Piscataway, NJ: IEEE Press
-
E. Bradley, C. A. Handwerker, J. Bath, R. D. Parker, and R. W. Gedney, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing. Piscataway, NJ: IEEE Press, 2007.
-
(2007)
Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing
-
-
Bradley, E.1
Handwerker, C.A.2
Bath, J.3
Parker, R.D.4
Gedney, R.W.5
-
6
-
-
77956761597
-
An industry vision on the implementation of WEEE and RoHS
-
Dec.8-11
-
A. Stevels, "An industry vision on the implementation of WEEE and RoHS," in Proc. 3rd Int. Symp. EcoDesign, Dec. 8-11, 2003, pp. 9-16.
-
(2003)
Proc. 3rd Int. Symp. EcoDesign
, pp. 9-16
-
-
Stevels, A.1
-
7
-
-
51349122717
-
From EU RoHS to China RoHS
-
L. Jinduo, X. Feng, G. Jing, and Y. Weihua, "From EU RoHS to China RoHS," in Proc. 8th ICEMI, 2007, pp. 2-472-2-474.
-
(2007)
Proc. 8th ICEMI
, pp. 2472-2474
-
-
Jinduo, L.1
Feng, X.2
Jing, G.3
Weihua, Y.4
-
10
-
-
29244480314
-
Are you ready for lead-free electronics
-
Dec.
-
V. Eveloy, S. Ganesan, Y. Fukuda, J.Wu, andM. G. Pecht, "Are you ready for lead-free electronics?" IEEE Trans. Compon. Packag. Technol., vol. 28, no. 4, pp. 884-894, Dec. 2005.
-
(2005)
IEEE Trans. Compon. Packag. Technol.
, vol.28
, Issue.4
, pp. 884-894
-
-
Eveloy, V.1
Ganesan, S.2
Fukuda, Y.3
Wu, J.4
Pecht, M.G.5
-
11
-
-
0003300090
-
-
R. Tummala et al., Ed. New York: Van Nostrand Reinhold
-
N. Koopman, T. C. Reiley, and P. A. Totta, Microelectronics Packaging Handbook, R. Tummala et al., Ed. New York: Van Nostrand Reinhold, 1989, p. 361.
-
(1989)
Microelectronics Packaging Handbook
, pp. 361
-
-
Koopman, N.1
Reiley, T.C.2
Totta, P.A.3
-
12
-
-
84965442974
-
-
Nostrand Reinhold, Ed. New York
-
D. R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, Microelectronics Packaging Handbook, V. Nostrand Reinhold, Ed. New York, 1989, p. 779.
-
(1989)
Microelectronics Packaging Handbook
, vol.5
, pp. 779
-
-
Tummala, D.R.R.1
Rymaszewski, E.J.2
Klopfenstein, A.G.3
-
13
-
-
84889274930
-
-
New York: Wiley-IEEE Press, Nov.
-
E. Bradley, C. A. Handwerker, J. Bath, R. D. Parker, and R. W. Gedney, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing. New York: Wiley-IEEE Press, Nov. 2007.
-
(2007)
Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing
-
-
Bradley, E.1
Handwerker, C.A.2
Bath, J.3
Parker, R.D.4
Gedney, R.W.5
-
14
-
-
0033221399
-
Development of conducting adhesive materials for microelectronic applications
-
Nov.
-
S. K. Kang and S. Purushothaman, "Development of conducting adhesive materials for microelectronic applications," J. Electron. Mater., vol. 28, no. 11, pp. 1314-1318, Nov. 1999.
-
(1999)
J. Electron. Mater.
, vol.28
, Issue.11
, pp. 1314-1318
-
-
Kang, S.K.1
Purushothaman, S.2
-
17
-
-
0003049188
-
An innovation in thermoplastic reworkable adhesive pastes
-
Jan.
-
R. Dietz and D. Peck, "An innovation in thermoplastic, reworkable adhesive pastes," Microelectron. Int., vol. 52, no. 39, pp. 52-56, Jan. 1996.
-
(1996)
Microelectron. Int.
, vol.52
, Issue.39
, pp. 52-56
-
-
Dietz, R.1
Peck, D.2
-
18
-
-
0029696375
-
Development of high conductivity lead Pb-free conducting adhesives
-
S. K. Kang, R. Rai, and S. Purushothaman, "Development of high conductivity lead (Pb)-free conducting adhesives," in Proc. 46th Electron. Compon. Technol. Conf., 1996, p. 565.
-
(1996)
Proc. 46th Electron. Compon. Technol. Conf.
, pp. 565
-
-
Kang, S.K.1
Rai, R.2
Purushothaman, S.3
-
19
-
-
2442496810
-
Joining mechanism and joint property by polymer adhesive with low melting alloy filler
-
K. Yasuda, J.M. Kim,M. Rito, and K. Fujimoto, "Joining mechanism and joint property by polymer adhesive with low melting alloy filler," in Proc. Int. Conf. Electron. Packag., 2003, pp. 149-154.
-
(2003)
Proc. Int. Conf. Electron. Packag.
, pp. 149-154
-
-
Yasuda, K.1
Kim, J.M.2
Rito, M.3
Fujimoto, K.4
-
20
-
-
18744407157
-
New process of selforganized interconnection in packaging by conductive adhesive with low melting point filler
-
K. Yasuda, J. M. Kim, M. Rito, and K. Fujimoto, "New process of selforganized interconnection in packaging by conductive adhesive with low melting point filler," in Proc. Int. Conf. Solid State Devices Mater., 2003, pp. 390-391.
-
(2003)
Proc. Int. Conf. Solid State Devices Mater.
, pp. 390-391
-
-
Yasuda, K.1
Kim, J.M.2
Rito, M.3
Fujimoto, K.4
-
21
-
-
2442532402
-
Adhesive joining process and joint property with low melting point filler
-
K. Yasuda, J. M. Kim, M. Rito, and K. Fujimoto, "Adhesive joining process and joint property with low melting point filler," in Proc. 3rd Int. IEEE Conf. Polym. Adhesives Microelectron. Photon., 2003, pp. 5-10.
-
(2003)
Proc. 3rd Int. IEEE Conf. Polym. Adhesives Microelectron. Photon.
, pp. 5-10
-
-
Yasuda, K.1
Kim, J.M.2
Rito, M.3
Fujimoto, K.4
-
22
-
-
0040077814
-
Interfacial versus cohesive failure on polymer-metal interfaces in electronic packaging-Effects of interface roughness
-
Jun.
-
Q. Yao and J. Qu, "Interfacial versus cohesive failure on polymer-metal interfaces in electronic packaging-Effects of interface roughness," J. Electron. Packag., vol. 124, no. 2, pp. 127-134, Jun. 2002.
-
(2002)
J. Electron. Packag.
, vol.124
, Issue.2
, pp. 127-134
-
-
Yao, Q.1
Qu, J.2
-
23
-
-
0002965428
-
Solder/polymer composite paste and method
-
Nov.
-
W. S. Huang, I. Khandros, R. Saraf, and L. Shi, "Solder/polymer composite paste and method," U.S. Patent 5 062 896, Nov. 5, 1991.
-
(1991)
U.S. Patent 5
, vol.62
, Issue.896
, pp. 5
-
-
Huang, W.S.1
Khandros, I.2
Saraf, R.3
Shi, L.4
-
24
-
-
0004019060
-
-
D. P. Seraphim, R. Lasky, and C. Y. Li, Eds. New York: McGraw-Hill
-
G. P. Schmitt, B. K. Appelt, and J. T. Gotro, Principles of Electronic Packaging, D. P. Seraphim, R. Lasky, and C. Y. Li, Eds. New York: McGraw-Hill, 1989, pp. 340-348.
-
(1989)
Principles of Electronic Packaging
, pp. 340-348
-
-
Schmitt, G.P.1
Appelt, B.K.2
Gotro, J.T.3
-
26
-
-
35348882067
-
Influence of nanoparticles low melting point LMP fillers, and conducting polymers on electrical mechanical and reliability performance of micro-filled conducting adhesives for Z-axis interconnections
-
R. N. Das, K. I. Papathomas, J. M. Lauffer, and F. D. Egitto, "Influence of nanoparticles, low melting point (LMP) fillers, and conducting polymers on electrical, mechanical, and reliability performance of micro-filled conducting adhesives for Z-axis interconnections," in Proc. 57th Electron. Compon. Technol. Conf., 2007, pp. 74-81.
-
(2007)
Proc. 57th Electron. Compon. Technol. Conf.
, pp. 74-81
-
-
Das, R.N.1
Papathomas, K.I.2
Lauffer, J.M.3
Egitto, F.D.4
-
27
-
-
44849105643
-
Can conductive adhesives with nanoparticles beat commonly used electrically conductive adhesives without nanoparticles
-
D. Busek, R. Radev, and P. Mach, "Can conductive adhesives with nanoparticles beat commonly used electrically conductive adhesives without nanoparticles?," in Proc. 30th Int. Spring Semin. Electron. Technol., 2007, pp. 7-11.
-
(2007)
Proc. 30th Int. Spring Semin. Electron. Technol.
, pp. 7-11
-
-
Busek, D.1
Radev, R.2
Mach, P.3
-
28
-
-
0035392379
-
Spatial distribution of metal fillers in isotropically conductive adhesives
-
Jul.
-
Y. Fu, M. Willander, and J. Liu, "Spatial distribution of metal fillers in isotropically conductive adhesives," J. Electron. Mater., vol. 30, no. 7, pp. 866-871, Jul. 2001.
-
(2001)
J. Electron. Mater.
, vol.30
, Issue.7
, pp. 866-871
-
-
Fu, Y.1
Willander, M.2
Liu, J.3
-
29
-
-
51349155558
-
Experimental performance analysis of new Ag conductive glues for electronic applications
-
May 12-15
-
M. Catelani, V. L. Scarano, R. Singuaroli, F. Bertocci, and P. Palchetti, "Experimental performance analysis of new Ag conductive glues for electronic applications," in Proc. IEEE Int. Instrum. Meas. Technol. Conf., May 12-15, 2008, pp. 270-273.
-
(2008)
Proc. IEEE Int. Instrum. Meas. Technol. Conf.
, pp. 270-273
-
-
Catelani, M.1
Scarano, V.L.2
Singuaroli, R.3
Bertocci, F.4
Palchetti, P.5
-
30
-
-
33748052034
-
Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
-
Oct.
-
L. Ye, Z. Lai, J. Liu, and A. Tholen, "Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives," IEEE Trans. Electron. Packag. Manuf., vol. 22, no. 4, pp. 299-302, Oct. 1999.
-
(1999)
IEEE Trans. Electron. Packag. Manuf.
, vol.22
, Issue.4
, pp. 299-302
-
-
Ye, L.1
Lai, Z.2
Liu, J.3
Tholen, A.4
-
31
-
-
84883615957
-
RoHS requirements for electronic applications: Measurements of characteristics of silver epoxy adhesives solder joints
-
Sep.22-24
-
M. Catelani, V. L. Scarano, R. Singuaroli, F. Bertocci, and P. Palchetti, "RoHS requirements for electronic applications: Measurements of characteristics of silver epoxy adhesives solder joints," in Proc. 16th IMEKO TC4 Symp. Conf., Sep. 22-24, 2008, pp. 799-803.
-
(2008)
Proc. 16th IMEKO TC4 Symp. Conf.
, pp. 799-803
-
-
Catelani, M.1
Scarano, V.L.2
Singuaroli, R.3
Bertocci, F.4
Palchetti, P.5
-
34
-
-
70450065454
-
Thermal stress on silver conductive adhesive solder joints: Performance evaluation of medical ultrasound array transducer
-
May 5-7
-
M. Catelani, V. L. Scarano, F. Bertocci, R. Singuaroli, P. Palchetti, and A. Grandoni, "Thermal stress on silver conductive adhesive solder joints: Performance evaluation of medical ultrasound array transducer," in Proc. IEEE Int. Instrum. Meas. Technol. Conf., May 5-7, 2009, pp. 468-471.
-
(2009)
Proc. IEEE Int. Instrum. Meas. Technol. Conf.
, pp. 468-471
-
-
Catelani, M.1
Scarano, V.L.2
Bertocci, F.3
Singuaroli, R.4
Palchetti, P.5
Grandoni, A.6
-
35
-
-
0032402972
-
Design guidelines for medical ultrasonic arrays
-
R. E. McKeighen, "Design guidelines for medical ultrasonic arrays," in Proc. SPIE Int. Symp. Med. Imaging, 1998, pp. 2-18.
-
(1998)
Proc. SPIE Int. Symp. Med. Imaging
, pp. 2-18
-
-
McKeighen, R.E.1
-
36
-
-
70449643431
-
New soldering technology for transducers: Characterization of a medical ultrasound phase array probe
-
May 29-30
-
M. Catelani, V. L. Scarano, F. Bertocci, R. Singuaroli, F. Gelli, and L. Spicci, "New soldering technology for transducers: Characterization of a medical ultrasound phase array probe," in Proc. Int. Workshop Med. Meas. Appl., May 29-30, 2009, pp. 183-186.
-
(2009)
Proc. Int. Workshop Med. Meas. Appl.
, pp. 183-186
-
-
Catelani, M.1
Scarano, V.L.2
Bertocci, F.3
Singuaroli, R.4
Gelli, F.5
Spicci, L.6
-
37
-
-
0032291883
-
Measurement issues in quantitative ultrasonic imaging
-
PII S001894569809696X
-
M. Siegel, "Measurement issues in quantitative ultrasonic imaging," IEEE Trans. Instrum. Meas., vol. 47, no. 6, pp. 1435-1438, Dec. 1998. (Pubitemid 128738616)
-
(1998)
IEEE Transactions on Instrumentation and Measurement
, vol.47
, Issue.6
, pp. 1435-1438
-
-
Siegel, M.1
-
38
-
-
34547879971
-
On the optimization of the transmitted beam in contrast-enhanced ultrasound medical imaging
-
Aug.
-
S. Curletto,M. Palmese, and A. Trucco, "On the optimization of the transmitted beam in contrast-enhanced ultrasound medical imaging," IEEE Trans. Instrum. Meas., vol. 56, no. 4, pp. 1239-1248, Aug. 2007.
-
(2007)
IEEE Trans. Instrum. Meas.
, vol.56
, Issue.4
, pp. 1239-1248
-
-
Curletto, S.1
Palmese, M.2
Trucco, A.3
-
39
-
-
70349654450
-
Investigation and prediction of solder joint reliability for ceramic area array packages under thermal cycling power cycling and vibration environments
-
Atlanta, GA, May
-
A. E. Perkins, "Investigation and prediction of solder joint reliability for ceramic area array packages under thermal cycling, power cycling, and vibration environments," Ph.D. dissertation, Georgia Inst. Technol., Atlanta, GA, May, 2007.
-
(2007)
Ph.D. dissertation Georgia Inst. Technol.
-
-
Perkins, A.E.1
-
42
-
-
0036992343
-
Single crystal-based phased array for transoesophagial ultrasound probe
-
S. Michau, P. Mauchamp, and R. Dufait, "Single crystal-based phased array for transoesophagial ultrasound probe," in Proc. IEEE Ultrasonics Symp., 2002, pp. 1269-1272.
-
(2002)
Proc. IEEE Ultrasonics Symp.
, pp. 1269-1272
-
-
Michau, S.1
Mauchamp, P.2
Dufait, R.3
|