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Volumn 39, Issue 2, 2010, Pages 200-208
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Effects of Ce and la additions on the microstructure and mechanical properties of Sn-9Zn solder joints
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Author keywords
BGA packages; Ni Au surface finishes; Sn 9Zn 0.5Ce; Sn 9Zn 0.5La; Tin whiskers
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Indexed keywords
AGING PROCESS;
AGING TREATMENT;
AIR EXPOSURE;
BALL GRID ARRAY PACKAGES;
BALL SHEAR STRENGTH;
BGA PACKAGE;
BONDING STRENGTH;
INTERMETALLIC COMPOUNDS;
INTERMETALLIC PHASIS;
METALLOGRAPHIC OBSERVATIONS;
MICROSTRUCTURE AND MECHANICAL PROPERTIES;
ROOM TEMPERATURE;
SN-9ZN SOLDER;
SOLDER JOINTS;
SOLDER MATRIX;
SURFACE FINISHES;
TIN WHISKER;
CERIUM;
CERIUM ALLOYS;
CERIUM COMPOUNDS;
CRYSTAL WHISKERS;
FINISHING;
INTERMETALLICS;
LANTHANUM;
LANTHANUM ALLOYS;
MECHANICAL PROPERTIES;
MICROSTRUCTURE;
PHASE INTERFACES;
SHEAR STRENGTH;
SOLDERED JOINTS;
SOLDERING ALLOYS;
TENSILE STRENGTH;
TENSILE TESTING;
TIN ALLOYS;
TITANIUM COMPOUNDS;
ZINC;
ZINC ALLOYS;
TIN;
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EID: 77951256977
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-009-0959-0 Document Type: Article |
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Times cited : (14)
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References (16)
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