-
2
-
-
0027150212
-
More electric aircraft
-
March
-
R. E. J. Quigley: "More electric aircraft", APEC, pp. 906-911, March 1993.
-
(1993)
APEC
, pp. 906-911
-
-
Quigley, R.E.J.1
-
3
-
-
84946021933
-
The role of electric machines and drives in the more electric aircraft
-
June
-
J. A. Weimer: "The role of electric machines and drives in the more electric aircraft", International Electric Machines and Drives Conference, vol.1, pp. 11-15, June 2003.
-
(2003)
International Electric Machines and Drives Conference
, vol.1
, pp. 11-15
-
-
Weimer, J.A.1
-
4
-
-
77954203788
-
De l'avion plus électrique à l'avion tout électrique : état de l'art et prospective sur les réseaux de bord
-
J3eA, Jour. sur l'enseignement des sciences et technologies de l'info. et des syst., Volume 4
-
O. Langlois, E. Foch, X. Roboam, H. Piquet: "De l'avion plus électrique à l'avion tout électrique : état de l'art et prospective sur les réseaux de bord", J3eA, Jour. sur l'enseignement des sciences et technologies de l'info. et des syst., Volume 4, Hors-Série 1(1), 2005.
-
(2005)
Hors-Série
, vol.1
, Issue.1
-
-
Langlois, O.1
Foch, E.2
Roboam, X.3
Piquet, H.4
-
5
-
-
49249090607
-
Thermomechanical Modelling and Reliability Study of an IGBT Module for an Aeronautical Application
-
Freiburg
-
A. Zéanh, O. Dalverny, M. Karama, É. Woirgard, S. Azzopardi, A. Bouzourene, J. Casutt, M. Mermet-Guyennet: "Thermomechanical Modelling and Reliability Study of an IGBT Module for an Aeronautical Application", EuroSimE 2008, Freiburg, 2008.
-
(2008)
EuroSimE 2008
-
-
Zéanh, A.1
Dalverny, O.2
Karama, M.3
Woirgard, É.4
Azzopardi, S.5
Bouzourene, A.6
Casutt, J.7
Mermet-Guyennet, M.8
-
6
-
-
33947674013
-
Technological study of an IGBT module for an aeronautical application in zone engine
-
Paper No 895, ISBN: 90-75815-08-5
-
T. Lhommeau, R. Meuret, M. Karama, "Technological study of an IGBT module for an aeronautical application in zone engine", 11th European Conference on Power Electronics and Applications (EPE 2005, Dresden), Paper No 895, ISBN: 90-75815-08-5, 2005.
-
(2005)
11th European Conference on Power Electronics and Applications (EPE 2005, Dresden
-
-
Lhommeau, T.1
Meuret, R.2
Karama, M.3
-
7
-
-
77954200310
-
Reliability of the connections used in IGBT modules, in aeronautical environment
-
A. Zéanh, O. Dalverny, M. Karama, É. Woirgard, S. Azzopardi, A. Bouzourene, J. Casutt, M. Mermet-Guyennet: "Reliability of the connections used in IGBT modules, in aeronautical environment", International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO), Vol 2, pp 123 - 133, 2008.
-
(2008)
International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO
, vol.2
, pp. 123-133
-
-
Zéanh, A.1
Dalverny, O.2
Karama, M.3
Woirgard, É.4
Azzopardi, S.5
Bouzourene, A.6
Casutt, J.7
Mermet-Guyennet, M.8
-
8
-
-
0036540853
-
Selected failure mechanisms of modern power modules
-
Ciappa, M.: "Selected failure mechanisms of modern power modules", Microelectronics reliability, Vol.42, issues 4-5, pp. 653-667, 2002.
-
(2002)
Microelectronics Reliability
, vol.42
, Issue.4-5
, pp. 653-667
-
-
Ciappa, M.1
-
10
-
-
77954201569
-
Environmental condition and test procedures for airborne equipment
-
DO 160
-
DO 160, "Environmental condition and test procedures for airborne equipment", RTCA Incorporated, 1997.
-
(1997)
RTCA Incorporated
-
-
-
11
-
-
69249212210
-
Characterization of ageing failures on power MOSFET devices by electron and ion microscopies
-
D. Martineau, T. Mazeaud, M. Legros, Ph. Dupuy, C. Levade, G. Vanderschaeve: "Characterization of ageing failures on power MOSFET devices by electron and ion microscopies", Microelectronics Reliability, Vol 49, pp. 1330-1333, 2009.
-
(2009)
Microelectronics Reliability
, vol.49
, pp. 1330-1333
-
-
Martineau, D.1
Mazeaud, T.2
Legros, M.3
Dupuy, Ph.4
Levade, C.5
Vanderschaeve, G.6
-
12
-
-
0031337138
-
Solder joints in electronics: Design for reliability
-
Warrendale, PA, February
-
W. Engelmaier, "Solder Joints in Electronics: Design for Reliability", the Minerals, Metals & Materials Society, Warrendale, PA, pp. 9-19, February 1997.
-
(1997)
The Minerals, Metals & Materials Society
, pp. 9-19
-
-
Engelmaier, W.1
-
13
-
-
0033904050
-
Solder joint fatigue models: Review and applicability to chip scale packages
-
W. W. Lee, L. T. Nguyen, G. S. Selvaduray, "Solder Joint Fatigue Models: Review and Applicability to Chip Scale packages", Microelectronics Reliability, Vol.40, pp. 231-244, 2000.
-
(2000)
Microelectronics Reliability
, vol.40
, pp. 231-244
-
-
Lee, W.W.1
Nguyen, L.T.2
Selvaduray, G.S.3
-
14
-
-
69349090740
-
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications
-
A. Micol, A. Zéanh, T. Lhommeau, S. Azzopardi, E. Woirgard, O. Dalverny, M. Karama, "An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications", Microelectronics Reliability, Vol 49, pp. 1370-1374, 2009.
-
(2009)
Microelectronics Reliability
, vol.49
, pp. 1370-1374
-
-
Micol, A.1
Zéanh, A.2
Lhommeau, T.3
Azzopardi, S.4
Woirgard, E.5
Dalverny, O.6
Karama, M.7
-
15
-
-
33748185664
-
Electromigration degradation mechanism for pb-free flip-chip micro solder bumps
-
T. Miyazaki, T. Omata, "Electromigration degradation mechanism for pb-free flip-chip micro solder bumps", Microelectronics Reliability, vol 46, pp. 1898-1903, 2006.
-
(2006)
Microelectronics Reliability
, vol.46
, pp. 1898-1903
-
-
Miyazaki, T.1
Omata, T.2
-
16
-
-
0024892890
-
Understanding the use of silicone gels for nonhermetic plastic packaging
-
Dec
-
C. P. Wong, J. M. Segelken, J. W. Balde, "Understanding the use of silicone gels for nonhermetic plastic packaging" IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Volume 12, Issue 4, pp. 421 - 425, Dec 1989.
-
(1989)
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, vol.12
, Issue.4
, pp. 421-425
-
-
Wong, C.P.1
Segelken, J.M.2
Balde, J.W.3
-
17
-
-
0036245360
-
Localization of electrical-insulation and partial-discharge failures of IGBT modules
-
G. Mitic, G. Lefranc, "Localization of electrical-insulation and partial-discharge failures of IGBT modules" IEEE Trans. on Indust. Applications, Volume 38, Issue 1, pp. 175 - 180, 2002.
-
(2002)
IEEE Trans. on Indust. Applications
, vol.38
, Issue.1
, pp. 175-180
-
-
Mitic, G.1
Lefranc, G.2
-
18
-
-
33947644968
-
Electrical characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications
-
11-14 Sept.
-
L. Dupont, Z. Khatir, S. Lefebvre, R. Meuret, B. Parmentier, S. Bontemps: "Electrical characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications", European Conference on Power Electronics and Applications, 11-14 Sept. 2005.
-
(2005)
European Conference on Power Electronics and Applications
-
-
Dupont, L.1
Khatir, Z.2
Lefebvre, S.3
Meuret, R.4
Parmentier, B.5
Bontemps, S.6
-
19
-
-
0038071718
-
Development of a directly bonded aluminium/alumina power electronic substrate
-
X. S. Ning, Y. Lin, W. Xu, R. Peng, H. Zhou, K. Chen: "Development of a directly bonded aluminium/alumina power electronic substrate", Materials Science and Engineering: B, Volume 99, No 1, pp. 479-482, 2003.
-
(2003)
Materials Science and Engineering: B
, vol.99
, Issue.1
, pp. 479-482
-
-
Ning, X.S.1
Lin, Y.2
Xu, W.3
Peng, R.4
Zhou, H.5
Chen, K.6
-
20
-
-
77954202462
-
Réalisation d'un assemblage Cu/AIN améliorant les propriétés thermiques : Expériences et simulation
-
T. Joyeux, M. El Ganaoui, J. Jarrige, J.-P. Lecompte: "Réalisation d'un assemblage Cu/AIN améliorant les propriétés thermiques : expériences et simulation", Physical and Chemical News PCN, 3, pp. 14-18, 2004.
-
(2004)
Physical and Chemical News PCN
, vol.3
, pp. 14-18
-
-
Joyeux, T.1
El Ganaoui, M.2
Jarrige, J.3
Lecompte, J.-P.4
-
22
-
-
61349160052
-
A computational framework of three-dimensional configurational-force- driven brittle crack propagation
-
E. Gürses, C. Miehe: "A computational framework of three-dimensional configurational-force-driven brittle crack propagation", Comp. Meth. in Applied Mech. and Engineering, Volume 198, Issues 15-16, pp. 1413-1428, 2009.
-
(2009)
Comp. Meth. in Applied Mech. and Engineering
, vol.198
, Issue.15-16
, pp. 1413-1428
-
-
Gürses, E.1
Miehe, C.2
-
23
-
-
77954207235
-
-
Presse polytechniques et universitairtes romandes
-
J.-M. Haussonne, C. Carry, P. Bowen, J. Barton: "Céramiques et verres, principes et techniques d'élaboration", Presse polytechniques et universitairtes romandes, (2005).
-
(2005)
Céramiques et Verres, Principes et Techniques d'Élaboration
-
-
Haussonne, J.-M.1
Carry, C.2
Bowen, P.3
Barton, J.4
-
25
-
-
0020716985
-
Statistical analysis of bending strengths for brittle solids: A multiaxial fracture problem
-
J. Lamon, A. G. Evans, "Statistical analysis of bending strengths for brittle solids: A multiaxial fracture problem", Journal of the American Ceramic Society, 66(3) 177-182, 1983.
-
(1983)
Journal of the American Ceramic Society
, vol.66
, Issue.3
, pp. 177-182
-
-
Lamon, J.1
Evans, A.G.2
-
26
-
-
0001527778
-
An engineer's approach to the prediction of failure probability of brittle components
-
P. Stanley, H. Fessler, & A. D. Sevill, "An engineer's approach to the prediction of failure probability of brittle components", Proc. Brit. Ceram. Soc., 22 453-487, 1973.
-
(1973)
Proc. Brit. Ceram. Soc.
, vol.22
, pp. 453-487
-
-
Stanley, P.1
Fessler, H.2
Sevill, A.D.3
-
27
-
-
0025572124
-
Weakest-link failure predictions for ceramics using finite element post-processing
-
L. J. M. G. Dortmans & G. De With, "Weakest-link Failure Predictions for Ceramics Using Finite Element Post-processing", Nether. Jour. of the European Ceram. Soc. 6 369-374, 1990.
-
(1990)
Nether. Jour. of the European Ceram. Soc.
, vol.6
, pp. 369-374
-
-
Dortmans, L.J.M.G.1
De With, G.2
-
30
-
-
77954182857
-
-
http://aluminium.matter.org.uk
-
-
-
-
34
-
-
84971434634
-
New structure of power integrated module
-
Naples, Italy, June 7-9
-
M. Mermet-Guyennet, "New structure of power integrated module", Proceedings of the CIPS, Naples, Italy, June 7-9, 2006.
-
(2006)
Proceedings of the CIPS
-
-
Mermet-Guyennet, M.1
|