Characterization of ageing failures on power MOSFET devices by electron and ion microscopies

Microelectronics Reliability

Volumn 49, Issue 9-11, 2009, Pages 1330-1333

  Martineau, D ^a   Mazeaud, T ^b   Legros, M ^a   Dupuy, Ph ^b   Levade, C ^a,c   Vanderschaeve, G ^a,c  

^a CEMES CNRS   (France)

^b FREESCALE SEMICONDUCTOR INC   (United States)

^c UNIVERSITÉ DE TOULOUSE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DE-COHESION; EUTECTIC ALLOYS; ION MICROSCOPY; LOCAL MELTING; METAL GRAINS; METALLIZATIONS; POWER MOSFET DEVICES; SOURCE RESISTANCE; THERMAL FATIGUE TESTS; WIRE BONDING;

FAILURE ANALYSIS; FATIGUE TESTING; SMELTING;

MOSFET DEVICES;

EID: 69249212210     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.07.011     Document Type: Article

References (12)

1. Muller-Fiedler R., and Knoblauch V. Reliability aspects of microsensors and micromechatronic actuators for automotive applications. Microelectron Reliab 43 7 (2003) 1085
2. Khong B., et al. Innovative methodology for predictive reliability of intelligent power devices using extreme electro-thermal fatigue. Microelectron Reliab 45 9-11 (2005) 1717
3. Lefebvre S., Khatir Z., and Saint-Eve F. Experimental behavior of single-chip IGBT and COOLMOS devices under repetitive short-circuit conditions. IEE Trans Electron Dev 52 (2005) 276
4. Belaid M.A., et al. Reliability study of power RF LDMOS device under thermal stress. Microelectron J 38 2 (2007) 164
5. Freescale Data Sheet MC15XS3400. .
6. Freescale Data Sheet MC10XS3435. .
7. Khong B., et al. Alterations induced in the structure of intelligent power devices by extreme electro-thermal fatigue. Physica Status Solidi (c) 4 (2007) 2997
8. Ciappa M. Selected failure mechanisms of modern power modules. Microelectron Reliab 42 (2002) 653
9. Arab M., Lefebvre S., Khatir Z., and Bontemps S. Experimental investigations of Trench Field Stop IGBT under repetitive short-circuits operations. Power Electron Specialists Conf (2008) 4355
10. Gao H., et al. Crack-like grain-boundary diffusion wedges in thin metal films. Acta Mater 47 10 (1999) 2865
11. Legros M, et al. Plasticity-related phenomena in metallic films on substrates. Multiscale phenomena in materials experiments and modeling related to mechanical behavior, San Francisco; 2003.
12. Legros M., Cabie M., and Gianola D.S. In situ deformation of thin films on substrates. Micros Res Tech 72 3 (2009) 270