Electrical characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications

2005 European Conference on Power Electronics and Applications

Volumn 2005, Issue , 2005, Pages

  Dupont, L ^a,b   Khatir, Z ^a   Lefebvre, S ^b   Meuret, R ^c   Parmentier, B ^d   Bontemps, S ^e  

^a UNIVERSITÉ GUSTAVE EIFFEL   (France)

^b Centre National de la Recherche Scientifique   (France)

^c SAFRAN AIRCRAFT ENGINES   (France)

^d SCHLUMBERGER   (United States)

^e APT Europe ^*  (France)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; AVIONICS; COMPUTER SIMULATION; CRACKS; FAILURE ANALYSIS; FRACTURE; THERMAL CYCLING;

CONCHOIDAL FRACTURE; HIGH TEMPERATURE CYCLES; SOLDER CRACK INITIATION; TEST VEHICLES;

POWER ELECTRONICS;

EID: 33947644968     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/epe.2005.219580     Document Type: Conference Paper

References (13)

1. W. Wondrack, "Physical Limits and Lifetime Limitations of Semiconductor Devices at High Temperatures", Microelectronics Reliability, June-July 1999, Vol. 39 (6-7), p. 1113-1120.
2. P. McCluskey and al., "Packaging of Power Electronics for High Temperature Applications", Advancing Microelectronics, Jan./Feb. 1998, p. 19-24.
3. L. Dupont and al., "Characterisation of Silicon Carbide Schottky Diodes and COOLMOS™ Transistors at High Temperature", in PESC conference, Aachen, 2004.
4. X. W. Liu and W. J. Plumbridge, "Thermomechanical Fatigue of Sn-37 wt.% Pb Model Solder Joints", Materials Science and Engineering A, 5 December 2003 2003, Vol. 362 (1-2), p. 309-321.
5. B. Y. Wu and Y. C. Chan, "Electric Current Effect on Microstructure of Ball Grid Array Solder Joint", Alloys and Compounds, 21 September 2005, Vol. 392, p. 237-246.
6. G. Mitic, R. Beinert, and al., "Reliability of AIN Substrates and their Solder Joints in IGBT Power Modules", Microelectronics Reliability, 1999, Vol. 39, p. 1159-1164.
7. thEVS conference, Montreal, Oct. 2000.
8. J. Schulz-Harder, "Advantages and New Development of direct Bonded Copper Substrates", Microelectronics Reliability, 2003, Vol. 43, p. 359-365.
9. ANSYS™, "ANSYS™ 8.0", Inc., Editor, 2002.
10. L. Anand, "Constitutive equations for hot-working of metals", International Journal of plasticity, 1985, Vol. vol.1, p. 213-231.
11. ANSYS™, "Rate-Dependent Plasticity ", 2005, ANSYS™ theory Book.
12. J. Wilde and al, "Rate Dependent Constitutive Relations Based on Anand Model for 92.5Pb5Sn2.5Ag Solder", IEEE transactions on Advanced Packaging, 2000, Vol. Vol.23 No 3, p. 408-414.
13. J. Shackelford and W. Alexander, "The Crc Materials Science and Engineering Handbook", CRC Press, 2000, Vol. Third Edition.