Accelerated mechanical fatigue testing and lifetime of interconnects in microelectronics

Procedia Engineering

Volumn 2, Issue 1, 2010, Pages 511-519

  Khatibi, G ^a   Lederer, M ^a   Weiss, B ^a   Licht, T ^b   Bernardi, J ^c   Danninger, H ^c  

^a UNIVERSITY OF VIENNA   (Austria)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

Accelerated testing; EBSD; Interconnects; Lifetime modeling; Mechanical shear fatigue

Indexed keywords

ACCELERATED TESTING; BOND AREAS; CYCLIC FATIGUE; ELASTO-PLASTIC FEM; ELECTRONIC COMPONENT; EXPERIMENTAL SETUP; FATIGUE LIFE; FEM MODELS; LOADING CYCLES; MECHANICAL FATIGUE; MECHANICAL FATIGUE TESTING; MECHANICAL SHEAR; MICROELECTRONIC COMPONENTS; MICROSTRUCTURAL INVESTIGATION; PACKAGING INDUSTRY; PLASTIC STRAIN; POWER CYCLING; RAPID DEVELOPMENT; RELIABILITY TESTING; S-N CURVE; SEM; TESTING TIME; ULTRASONIC FATIGUE TESTING SYSTEM; WIRE BONDS;

FINITE ELEMENT METHOD; MICROELECTRONICS; MICROSTRUCTURAL EVOLUTION; SHEAR STRESS; STEEL BRIDGES; STRENGTH OF MATERIALS; STRESS ANALYSIS; THERMAL CYCLING; ULTRASONIC APPLICATIONS; WIRE;

FATIGUE TESTING;

EID: 77954127440     PISSN: None     EISSN: 18777058     Source Type: Conference Proceeding    
DOI: 10.1016/j.proeng.2010.03.055     Document Type: Conference Paper

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