An alternative model for elastic thermal stresses in two materials joined by a graded layer

Composites Part B: Engineering

Volumn 41, Issue 5, 2010, Pages 375-379

  Zhang, Neng Hui ^a   Chen, Jian Zhong ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

Analytical modeling; Layered structures; Thermomechanical

Indexed keywords

COMPRESSIVE STRESS; GALLIUM ARSENIDE; SEMICONDUCTING GALLIUM; THERMAL STRESS;

CLOSED-FORM ANALYTICAL SOLUTIONS; DIFFERENT THICKNESS; ELASTIC STRESS DISTRIBUTION; LAYERED STRUCTURES; THERMO-MECHANICAL; THREE-VARIABLE MODELS; TRANSITION PHENOMENON; TWO-VARIABLE METHOD;

ANALYTICAL MODELS;

EID: 77953958824     PISSN: 13598368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesb.2010.02.004     Document Type: Article

References (21)

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