Enhanced adhesion of diamond-like carbon films with a composition-graded intermediate layer

Applied Physics A: Materials Science and Processing

Volumn 68, Issue 3, 1999, Pages 343-347

  Hou, Q R ^a   Gao, J ^a  

^a UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CARBON; COMPOSITION EFFECTS; DEPOSITION; LASER ABLATION; PULSED LASER APPLICATIONS; SILICON WAFERS; STRESS ANALYSIS; THERMAL STRESS;

DIAMOND LIKE CARBON (DLC) FILMS; INTRINSIC STRESS;

AMORPHOUS FILMS;

EID: 0033099125     PISSN: 09478396     EISSN: None     Source Type: Journal    
DOI: 10.1007/s003390050900     Document Type: Article

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