Elastic bending analysis of bilayered beams by an alternative two-variable method

European Journal of Mechanics, A/Solids

Volumn 28, Issue 2, 2009, Pages 284-288

  Zhang, Neng Hui ^a   Chen, Jian Zhong ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

Bending analysis; Bilayered beam; Neutral axis; Two variable method

Indexed keywords

GALLIUM ALLOYS; THERMAL EXPANSION; THERMAL SPRAYING; THERMOELASTICITY; TOOLS;

BENDING ANALYSIS; BILAYERED BEAM; ELASTIC BENDING; EXPANSION COEFFICIENTS; INTERNAL STRESSES; LOADING RATIO; NEUTRAL AXIS; PARAMETER CONDITIONING; STONEY'S MODEL; SUBSTRATE WAFERS; TWO-VARIABLE METHOD;

METHOD OF MOMENTS;

EID: 58749107367     PISSN: 09977538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.euromechsol.2008.07.004     Document Type: Article

References (19)

1. Beer F.P., and Johnston Jr. E.R. Mechanics of Materials (1981), McGraw-Hill, New York
2. Chu S.N.G. Elastic bending of semiconductor wafer revisited and comments on Stoney's equation. J. Electrochem. Soc. 145 10 (1998) 3621-3627
3. Chuang T.J., and Lee S. Elastic flexure of bilayered beams subjected to strain differentials. J. Mater. Res. 15 12 (2000) 2780-2788
4. Freund L.B. The stress distribution and curvature of a general compositionally graded semiconductor layer. J. Crystal Growth 132 1-2 (1993) 341-344
5. Freund L.B. Some elementary connections between curvature and mismatch strain in compositionally graded thin films. J. Mech. Phys. Solids 44 5 (1996) 723-736
6. Hearn E.J. Mechanics of Materials (1977), Pergamon Press, Oxford, UK
7. Hsueh C.H. Modeling of elastic deformation of multilayers due to residual stresses and external bending. J. Appl. Phys. 91 12 (2002) 9652-9656
8. Hsueh C.H. Thermal stresses in elastic multilayer systems. Thin Solid Films 418 2 (2002) 182-188
9. Hsueh C.H. Stress distribution and curvature in graded semiconductor layers. J. Crystal Growth 258 3-4 (2003) 302-309
10. Hsueh C.H., and Evans A.G. Residual stresses in metal/ceramic bonded strips. J. Am. Ceram. Soc. 68 5 (1985) 241-248
11. Hsueh C.H., and Lee S. Modeling of elastic thermal stresses in two materials joined by a graded layer. Composites B 34 8 (2003) 747-752
12. Hsueh C.H., Lee S., and Chuang T.J. An alternative method of solving multilayered bending problems. J. Appl. Mech. 70 1 (2003) 151-154
13. Liu H.C., and Murarka S.P. Elastic and viscoelastic analysis of stress in thin films. J. Appl. Phys. 72 8 (1992) 3458-3463
14. Stoney G.G. The tension of metallic films deposited by electrolysis. Proc. Phys. Soc. London, Ser. A 82 (1909) 172-175
15. Timoshenko S. Analysis of bi-metal thermostats. J. Opt. Soc. Am. 11 (1925) 233-255
16. Timoshenko S. Strength of Materials, Part I: Elementary Theory and Problems (1955), D. Van Norstrand Company, New York
17. Townsend P.H., Barnett D.M., and Brunner T.A. Elastic relationships in layered composite media with approximation for the case of thin films on a thick substrate. J. Appl. Phys. 62 11 (1987) 4438-4444
18. Zhang N.H. Thermoelastic stresses in multilayered beams. Thin Solid Films 515 23 (2007) 8402-8406
19. Zhang N.H., and Xing J.J. An alternative model for elastic bending deformation of multilayered beams. J. Appl. Phys. 100 (2006) 103519