Effect of phonon dispersion on thermal conduction across Si/Ge interfaces

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 1, Issue , 2010, Pages 575-591

  Singh, Dhruv ^a   Murthy, Jayathi Y ^a   Fisher, Timothy S ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC PHONONS; BOLTZMANN TRANSPORT EQUATION; BOUNDARY SCATTERING; DIFFUSE MISMATCH MODELS; FINITE VOLUME SIMULATIONS; HETEROGENEOUS INTERFACES; HOST MATERIALS; KNUDSEN NUMBERS; NON EQUILIBRIUM; PHONON DISPERSIONS; PHONON SPECTRUM; SI/GE; SUBMICRON; SUPERLATTICE PERIODS; THERMAL CONDUCTION; THERMAL RESISTANCE;

ACOUSTIC DISPERSION; BOLTZMANN EQUATION; GERMANIUM; HEAT RESISTANCE; STRAIN MEASUREMENT; SUPERLATTICES; THERMAL CONDUCTIVITY; THERMOANALYSIS;

PHONONS;

EID: 77953798571     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89208     Document Type: Conference Paper

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