Thermal conductivity modeling of periodic two-dimensional nanocomposites

Physical Review B - Condensed Matter and Materials Physics

Volumn 69, Issue 19, 2004, Pages

  Yang, Ronggui ^a   Chen, Gang ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON;

ARTICLE; CONDUCTANCE; ENERGY; MATERIALS; MATHEMATICAL ANALYSIS; MODEL; NANOTECHNOLOGY; PHONON; SEMICONDUCTOR; TEMPERATURE; THERMAL CONDUCTIVITY;

EID: 40549142332     PISSN: 01631829     EISSN: None     Source Type: Journal    
DOI: 10.1103/PhysRevB.69.195316     Document Type: Article

References (62)

1. H. J. Golsmid, Thermoelectric Refrigeration (Plenum, New York, 1964).
2. Special Issues on Thermoelectrics, edited by T. M. Tritt, Semicond. Semimetals 69-71 (2001).
3. M. S. Dresselhaus, Y. M. Lin, S. B. Cronin, O. Rabin, M. R. Black, G. Dresselhaus, and T Koga, Semicond. Semimetals 71, 1 (2001).
4. G. Chen, Semicond. Semimetals 71, 2003 (2001).
5. R. Venkatasubramanian, Semicond. Semimetals 71, 175 (2001).
6. T. C. Harman, P. J. Taylor, M. P. Walsh, and B. E. LaForge, Science 297, 2229 (2002).
7. R. Venkatasubramanian, E. Silvona, T. Colpitts, and B. O'Quinn, Nature (London) 413, 597 (2001).
8. G. Chen, D. Borca-Tasciuc, and R. G. Yang, in Encyclopedia of Nanoscience and Nanotechnology, edited by H. S. Nalwa (American Scientific Publishers, Stevenson Ranch, CA, 2004), Vol. 7, N68.
9. B. Yang and G. Chen, Phys. Rev. B 67, 195311 (2003).
10. P. Hyldgaard and G. D. Mahan, Phys. Rev. B 56, 10754 (1997).
11. S. Tamura, Y. Tanaka, and H. J. Maris, Phys. Rev. B 60, 2627 (1999).
12. W. E. Bies, R. J. Radtke, and H. Ehrenreich, J. Appl. Phys. 88, 1498 (2000).
13. B. Yang and G. Chen, Microscale Thermophys. Eng. 5, 107 (2001).
14. G. Chen, ASME J. Heat Transfer 119, 220 (1997).
15. G. Chen and M. Neagu, Appl. Phys. Lett. 71, 2761 (1997).
16. G. Chen, Phys. Rev. B 57, 14958 (1998).
17. P. Hyldgaard and G. D. Mahan, Therm. Conduct. 23, 172 (1996).
18. M. V. Simkin and G. D. Mahan, Phys. Rev. Lett. 84, 927 (2000).
19. B. Daly, H. Maris, K. Imamura, and S. Tamura, Phys. Rev. B 66, 024301 (2002).
20. C. Dames and G. Chen, J. Appl. Phys. 95, 682 (2004).
21. G. W. Milton, The Theory of Composites (Cambridge University Press, New York, 2002).
22. P. L. Kapitza, J. Phys. 4, 181 (1941); for a review on thermal boundary resistance, see Ref. 49.
23. D. P. H. Hasselman and L. F. Johnson, J. Compos. Mater. 21, 508 (1987).
24. Y. Benvensite, J. Appl. Phys. 61, 2840 (1987); Y. Benvensite and T. Miloh, ibid. 69, 1337 (1991).
25. Y. Benvensite, J. Appl. Phys. 61, 2840 (1987); Y. Benvensite and T. Miloh, ibid. 69, 1337 (1991).
26. A. G. Every, Y. Tzou, D. P. H. Hasselman, and R. Raj, Acta Metall. Mater. 40, 123 (1992).
27. C.-W. Nan, R. Birringer, D. R. Clarke, and H. Gleiter, J. Appl. Phys. 81, 6692 (1997).
28. C.-W. Nan and F. S. Jin, Phys. Rev. B 48, 8578 (1993); C.-W. Nan, J. Appl. Phys. 76, 1155 (1994).
29. C.-W. Nan and F. S. Jin, Phys. Rev. B 48, 8578 (1993); C.-W. Nan, J. Appl. Phys. 76, 1155 (1994).
30. P. A. Smith and S. Torquato, J. Appl. Phys. 65, 893 (1989); S. Torquato and M. D. Rintoul, Phys. Rev. Lett. 75, 4067 (1995).
31. P. A. Smith and S. Torquato, J. Appl. Phys. 65, 893 (1989); S. Torquato and M. D. Rintoul, Phys. Rev. Lett. 75, 4067 (1995).
32. R. Lipton and B. Vernescu, J. Appl. Phys. 79, 8964 (1996).
33. See, for example, M. Jiang, I. Jasiuk, and M. Ostoja-Starzewski, Comput. Mater. Sci. 25, 329 (2002); F. W. Jones and F. Pascal, Geophysics 60, 1038 (1995).
34. See, for example, M. Jiang, I. Jasiuk, and M. Ostoja-Starzewski, Comput. Mater. Sci. 25, 329 (2002); F. W. Jones and F. Pascal, Geophysics 60, 1038 (1995).
35. S. Graham and D. L. McDowell, ASME J. Heat Transfer 125, 389 (2003).
36. K. Ramani and A. Vaidyanathan, J. Compos. Mater. 29, 1725 (1995).
37. M. R. Islam and A. Pramila, J. Compos. Mater. 33, 1699 (1999).
38. A. Khitun, A. Balandini, J. L. Liu, and K. L. Wang, J. Appl. Phys. 88, 696 (2000); Superlattices Microstruct. 30, 1 (2001); A. Khitun, K. L. Wang, and G. Chen, Nanotechnology 11, 327 (2000); J. L. Liu et al., Phys. Rev. B 67, 165333 (2003).
39. A. Khitun, A. Balandini, J. L. Liu, and K. L. Wang, J. Appl. Phys. 88, 696 (2000); Superlattices Microstruct. 30, 1 (2001); A. Khitun, K. L. Wang, and G. Chen, Nanotechnology 11, 327 (2000); J. L. Liu et al., Phys. Rev. B 67, 165333 (2003).
40. A. Khitun, A. Balandini, J. L. Liu, and K. L. Wang, J. Appl. Phys. 88, 696 (2000); Superlattices Microstruct. 30, 1 (2001); A. Khitun, K. L. Wang, and G. Chen, Nanotechnology 11, 327 (2000); J. L. Liu et al., Phys. Rev. B 67, 165333 (2003).
41. A. Khitun, A. Balandini, J. L. Liu, and K. L. Wang, J. Appl. Phys. 88, 696 (2000); Superlattices Microstruct. 30, 1 (2001); A. Khitun, K. L. Wang, and G. Chen, Nanotechnology 11, 327 (2000); J. L. Liu et al., Phys. Rev. B 67, 165333 (2003).
42. O. L. Lazarenkova and A. A. Balandin, J. Appl. Phys. 89, 5509 (2001); Phys. Rev. B 66, 245319 (2002); A. A. Balandin and O. L. Lazarenkova, Appl. Phys. Lett. 82, 415 (2003).
43. O. L. Lazarenkova and A. A. Balandin, J. Appl. Phys. 89, 5509 (2001); Phys. Rev. B 66, 245319 (2002); A. A. Balandin and O. L. Lazarenkova, Appl. Phys. Lett. 82, 415 (2003).
44. O. L. Lazarenkova and A. A. Balandin, J. Appl. Phys. 89, 5509 (2001); Phys. Rev. B 66, 245319 (2002); A. A. Balandin and O. L. Lazarenkova, Appl. Phys. Lett. 82, 415 (2003).
45. J. M. Ziman, Electrons and Phonons (Oxford University Press, London, 1985).
46. R. Prasher, Appl. Phys. Lett. 83, 48 (2003); ASME J. Heat Transfer 125, 1156 (2003).
47. R. Prasher, Appl. Phys. Lett. 83, 48 (2003); ASME J. Heat Transfer 125, 1156 (2003).
48. A. Majumdar, ASME J. Heat Transfer 115, 7 (1993).
49. G. Chen and C. L. Tien, J. Thermophys. Heat Transfer 7, 311 (1993).
50. R. Siegel and J. R. Howell, Thermal Radiation Heat Transfer, 4th ed. (Taylor & Francis, Washington, D.C., 2001).
51. M. F. Modest, Radiative Heat Transfer, 2nd ed. (Academic Press, New York, 2003).
52. A. A. Joshi and A. Majumdar, J. Appl. Phys. 74, 31 (1993).
53. P. G. Klemens, Solid State Phys. 7, 1 (1958).
54. K. E. Goodson and Y. S. Ju, Annu. Rev. Mater. Sci. 29, 261 (1999).
55. P. Markowich, C. Ringhofer, and C. Schmeiser, Semiconductor Equations (Springer, Wien, 1990).
56. R. G. Yang, G. Chen, M. Laroche, and Y. Taur, ASME J. Heat Transfer (to be published).
57. R. M. Costescu, M. A. Wall, and D. G. Cahill, Phys. Rev. B 67, 054302 (2003).
58. D. G. Cahill, W. K. Ford, K. E. Goodson, G. D. Mahan, A. Majumdar, H. J. Maris, R. Merlin, and S. R. Phillpot, J. Appl. Phys. 93, 793 (2003).
59. E. T. Swartz and R. O. Pohl, Rev. Mod. Phys. 61, 605 (1989).
60. W. A. Fiveland, ASME J. Heat Transfer 109, 809 (1987); J. S. Truelove, ibid. 109, 1048 (1987).
61. W. A. Fiveland, ASME J. Heat Transfer 109, 809 (1987); J. S. Truelove, ibid. 109, 1048 (1987).
62. G. D. Raithby, Numer. Heat Transfer, Part B 35, 389 (1994).