The use of surface modifiers to mitigate pattern collapse in thin film lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7639, Issue , 2010, Pages

  Noga, David E ^a   Yeh, Wei Ming ^a   Lawson, Richard A ^a   Tolbert, Laren M ^b   Henderson, Clifford L ^a  

^a Georgia Institute of Technology   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

adhesion failure; Pattern collapse; surface modifiers

Indexed keywords

ADHESION FAILURES; COVALENT ATTACHMENT; E-BEAM LITHOGRAPHY; HIGH-RESOLUTION IMAGING; HYDROXYSTYRENE; LINE EDGE ROUGHNESS; LITHOGRAPHIC TECHNOLOGIES; PATTERN COLLAPSE; POSITIVE TONE; POSITIVE-TONE RESISTS; POST APPLY BAKES; REACTIVE SURFACES; SILANIZATIONS; SURFACE MODIFIERS;

ADHESION; ETHERS; SURFACE ACTIVE AGENTS; SURFACE REACTIONS; SURFACES;

PHOTORESISTS;

EID: 77953486678     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.862008     Document Type: Conference Paper

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