Single point diamond turning effects on surface quality and subsurface damage in ceramics

Proceedings of the ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009

Volumn 1, Issue , 2009, Pages 707-713

  Ravindra, Deepak ^a   Patten, John A ^a   Qu, Jun ^b  

^a WESTERN MICHIGAN UNIVERSITY   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED CERAMICS; AMORPHOUS LAYER; BRITTLE MATERIALS; DAMAGE-FREE SURFACES; DEPTH OF CUT; DUCTILE REGIME; HIGH HARDNESS; INITIAL HYPOTHESIS; LIGHT WEIGHT; MACHINING PARAMETERS; MATERIAL REMOVAL RATE; MATERIAL-REMOVAL METHODS; NONDESTRUCTIVE METHODS; OPTOELECTRONIC APPLICATIONS; SCANNING ACOUSTIC MICROSCOPY; SINGLE POINT DIAMOND TURNING; SUB-SURFACE DAMAGE; SUB-SURFACE IMAGING; SURFACE FINISHES; SURFACE QUALITIES;

ACOUSTIC MICROSCOPES; ACOUSTIC SPECTROSCOPY; ACOUSTIC VARIABLES MEASUREMENT; CERAMIC MATERIALS; DUCTILITY; FRACTURE; FRACTURE TOUGHNESS; INDUSTRIAL APPLICATIONS; OPTICAL DATA STORAGE; OPTICAL INSTRUMENTS; OPTICAL MICROSCOPY; OXIDE MINERALS; QUARTZ; RAMAN SCATTERING; RAMAN SPECTROSCOPY; SILICON CARBIDE; TURNING;

SURFACES;

EID: 77953218561     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/MSEC2009-84113     Document Type: Conference Paper

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