Flip-chip integrated soi-cmos-mems fabrication technology

Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop

Volumn , Issue , 2008, Pages 10-13

  Gilgunn, P J ^a   Fedder, G K ^a,b,c  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

^c CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CMOS INTEGRATED CIRCUITS; ELECTROSTATIC ACTUATORS; FABRICATION; MICROSYSTEMS; MIRRORS; SILICON ON INSULATOR TECHNOLOGY; SOLID-STATE SENSORS;

ASPECT RATIO DEPENDENT ETCHINGS; DEEP REACTIVE ION ETCHING; ELECTRO-THERMAL ACTUATORS; FLIP CHIP BONDING; HIGH TEMPERATURE; RADIUS OF CURVATURE; SILICON ON INSULATOR STRUCTURES; SILICON THICKNESS;

FLIP CHIP DEVICES;

EID: 77952785241     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31438/trf.hh2008.3     Document Type: Conference Paper

References (12)

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