Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 1175-1178

  Xie, Jin ^a   Lee, Chengkuo ^a,b   Wang, Ming Fang ^a   Feng, Hanhua ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS COMPATIBLE; CMOS-MEMS; COLD JUNCTIONS; LOW TEMPERATURES; N-DOPED; NOVEL DESIGN; POWER EFFICIENCY; POWER GENERATORS; TEMPERATURE DIFFERENCES; THERMOELECTRIC POWER GENERATORS; TWO-CAVITY; VACUUM SEALING; WAFER LEVEL;

CMOS INTEGRATED CIRCUITS; FABRICATION; MECHANICAL ENGINEERING; MECHANICS; POLYSILICON; REACTIVE ION ETCHING; THERMOCOUPLES; THERMOELECTRIC POWER; VACUUM;

VACUUM APPLICATIONS;

EID: 77952759380     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442421     Document Type: Conference Paper

References (6)

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