Experimental validation of the power blurring method

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2010, Pages 240-244

  Park, Je Hyoung ^a   Shin, Sangho ^b   Christofferson, James ^a   Shakouri, Ali ^a   Kang, Sung Mo ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b University of California   (United States)

Author keywords

Finite element method (FEM); Green's function technique; Power blurring; Power dissipation profile (power map); Ring oscillator; Temperature distribution (thermal profile); Thermal simulation; Thermal test chip

Indexed keywords

GREEN'S FUNCTION TECHNIQUE; POWER BLURRING; POWER DISSIPATION; RING OSCILLATOR; THERMAL PROFILES; THERMAL SIMULATIONS; THERMAL TEST CHIPS;

COMPUTER SIMULATION; GREEN'S FUNCTION; OSCILLATORS (ELECTRONIC); TEMPERATURE CONTROL; TEMPERATURE DISTRIBUTION; THERMAL VARIABLES MEASUREMENT; THERMOANALYSIS;

FINITE ELEMENT METHOD;

EID: 77952655211     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2010.5444285     Document Type: Conference Paper

References (12)

1. th International Workshop on Thermal Investications of ICs (THERMINIC), pp. 133-137, Nice, France, 2006.
2. K. Banerjee, S. C. Lin, A. Keshavarzi, S. Narendra, and V. De, "A Self-Consistent Junction Temperature Estimation Methodology for Nanometer Scale ICs with Implications for Performance and Thermal Management," IEDM, 2003.
3. V. M. Heriz, J. H. Park, A. Shakouri, and S. M. Kang, "Method of Images for the Fast Calculation of Temperature Distributions in Packaged VLSI Chips," Proceedings of 13th International Workshop on Thermal investigations of ICs (THERMINIC), Budapest, Hungary, September 17-19, 2007.
4. th Semiconductor Thermal Measurement, Modeling, and Management Symposium (Semi-Therm), pp. 51-55, San Jose, March 16-20, 2008.
5. th International Symposium on Quality Electronic Design (ISQED), pp. 600-603, San Jose, March 17-19, 2008.
6. J. H. Park, A. Shakouri, and S. M. Kang, "Fast Thermal Analysis of Vertically Integrated Circuits (3-D Ics) Using Power Blurring Method," Proc. of the InterPACK Conference, San Francisco, July 19-23, 2009.
7. th Edition, 1984.
8. C. A. Balanis, "Advanced Engineering Electromagnetics," John Wiley & Sons, New York, 1989, chap. 14.
9. ANSYS R11.0, Swanson ANSYS Inc., 2007.
10. nd Edition, Prentice-Hall, 2003.
11. Mega-Pixel ThermoVision SC8000 MWIR (http://www.flirthermography.com/ cameras/camera/1110)
12. Omega Engineering, Inc. (http://www.omega.com)