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Volumn , Issue , 2007, Pages 18-25
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Method of images for the fast calculation of temperature distributions in packaged VLSI chips
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Author keywords
[No Author keywords available]
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Indexed keywords
BOUNDARY CONDITIONING;
COMPLEX POWER;
ERROR LESS;
FAST CALCULATION;
FINITE ELEMENT ANALYSIS;
FINITE ELEMENT SIMULATIONS;
HEAT SOURCING;
IMAGE BLURRING;
METHOD OF IMAGES;
PLACEMENT ALGORITHMS;
SIMULATION RESULTS;
STEADY-STATE TEMPERATURE;
TEMPERATURE PROFILING;
VLSI CHIPS;
WEIGHTING FUNCTIONS;
BOUNDARY CONDITIONS;
BOUNDARY VALUE PROBLEMS;
CHLORINE COMPOUNDS;
DIFFERENTIAL EQUATIONS;
EDGE DETECTION;
GLASS INDUSTRY;
GREEN'S FUNCTION;
IMAGE ENHANCEMENT;
ROUTING ALGORITHMS;
TEMPERATURE;
TEMPERATURE DISTRIBUTION;
THERMOANALYSIS;
THERMOSTATS;
FINITE ELEMENT METHOD;
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EID: 48049123093
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/THERMINIC.2007.4451740 Document Type: Conference Paper |
Times cited : (24)
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References (6)
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