-
1
-
-
36949014512
-
Microscale and Nanoscale Thermal Characterization Techniques
-
THETA, pp, Cairo, Egypt, Jan. 3-6
-
st International Conference on Thermal Issues in Emerging Technologies: Theory and Application (THETA), pp. 3-9, Cairo, Egypt, Jan. 3-6, 2007.
-
(2007)
st International Conference on Thermal Issues in Emerging Technologies: Theory and Application
, pp. 3-9
-
-
Christofferson, J.1
Maize, K.2
Ezzahri, Y.3
Shabani, J.4
Wang, X.5
Shakouri, A.6
-
2
-
-
13444301477
-
Temperature variation mapping of a microelectromechanical system by thermoreflectance imaging
-
Stéphane Grauby, Stefan Dilhaire, Sébastien Jorez, and Wilfrid Claeys, "Temperature variation mapping of a microelectromechanical system by thermoreflectance imaging", IEEE Electron Device Letters, Vol. 26, pp. 78-80, 2005.
-
(2005)
IEEE Electron Device Letters
, vol.26
, pp. 78-80
-
-
Grauby, S.1
Dilhaire, S.2
Jorez, S.3
Claeys, W.4
-
3
-
-
41349113939
-
Ultrafast Temperature Profile Calculation in IC chips
-
Nice, France, pp
-
Travis Kemper, Yan Zhang, Zhixi Bian, and Ali Shakouri, "Ultrafast Temperature Profile Calculation in IC chips," Proceedings of 12th International Workshop on Thermal investigations of ICs (THERMINIC), Nice, France, pp. 133-137, 2006.
-
(2006)
Proceedings of 12th International Workshop on Thermal investigations of ICs (THERMINIC)
, pp. 133-137
-
-
Kemper, T.1
Zhang, Y.2
Bian, Z.3
Shakouri, A.4
-
4
-
-
48049123093
-
Method of Images for the Fast Calculation of Temperature Distributions in Packaged VLSI Chips
-
Budapest, Hungary, September 17-19
-
Virginia Martin Heriz, Je-Hyoung Park, Ali Shakouri, and Sung-Mo Kang, "Method of Images for the Fast Calculation of Temperature Distributions in Packaged VLSI Chips," Proceedings of 13th International Workshop on Thermal investigations of ICs (THERMINIC), Budapest, Hungary, September 17-19, 2007.
-
(2007)
Proceedings of 13th International Workshop on Thermal investigations of ICs (THERMINIC)
-
-
Martin Heriz, V.1
Park, J.-H.2
Shakouri, A.3
Kang, S.-M.4
-
6
-
-
51349119688
-
-
1.0, Swanson ANSYS Inc
-
ANSYS Rl 1.0, Swanson ANSYS Inc., 2007
-
(2007)
-
-
ANSYS, R.1
-
7
-
-
0033343885
-
An Efficient Method for Hot-spot Identification in ULSI Circuits
-
San Jose, CA, pp
-
Yi-Kan Cheng and Sung-Mo Kang, "An Efficient Method for Hot-spot Identification in ULSI Circuits," Proceedings of the IEEE/ACM international Conference on Computer-aided design (ICCAD), San Jose, CA, pp. 124-127, 1999.
-
(1999)
Proceedings of the IEEE/ACM international Conference on Computer-aided design (ICCAD)
, pp. 124-127
-
-
Cheng, Y.-K.1
Kang, S.-M.2
-
8
-
-
33751427407
-
A High Efficiency Full-Chip Thermal Simulation Algorithm
-
San Jose, CA, pp
-
Yong Zhan and Sachin S. Sapatnekar, "A High Efficiency Full-Chip Thermal Simulation Algorithm," Proceedings of the IEEE/ACM International conference on Computer-aided design (ICCAD), San Jose, CA, pp. 635-638, 2005.
-
(2005)
Proceedings of the IEEE/ACM International conference on Computer-aided design (ICCAD)
, pp. 635-638
-
-
Zhan, Y.1
Sapatnekar, S.S.2
-
9
-
-
36949000852
-
DJOSER: Analytical Thermal Simulator for Multilayer Electronic Structures. Theory and Numerical Implementation
-
THETA, pp, Cairo, Egypt, Jan. 3-6
-
st International Conference on Thermal Issues in Emerging Technologies: Theory and Application (THETA), pp. 111-118, Cairo, Egypt, Jan. 3-6, 2007.
-
(2007)
st International Conference on Thermal Issues in Emerging Technologies: Theory and Application
, pp. 111-118
-
-
Emilio Bagnoli, P.1
Casarosa, C.2
Stefani, F.3
-
10
-
-
0004156935
-
-
MATLAB R
-
MATLAB R2006b, The Math Works, 2006
-
(2006)
The Math Works
-
-
|