A novel conduction-convection based cooling solution for 3D stacked electronics

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2010, Pages 33-40

  Kota, Krishna ^a   Hidalgo, Pablo ^a   Joshi, Yogendra ^a   Glezer, Ari ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

3D stacked electronics; Conduction; Immersion cooling; Natural convection; Sandwiched spreaders

Indexed keywords

3D STACKED ELECTRONICS; CONDUCTION; COOLING AIR; COOLING SOLUTIONS; HEATED AIR; HIGH-POWER; IMMERSION COOLING; LIQUID INTERFACE; LOCAL HEAT TRANSFER COEFFICIENT; NUMERICAL SIMULATION; OVERALL HEAT TRANSFER COEFFICIENT; PARAMETRIC STUDY; SYNTHETIC JET ACTUATORS; THERMAL MANAGEMENT; THERMAL PATHS;

ACTUATORS; AIR ENTRAINMENT; COOLING; DIELECTRIC LIQUIDS; FINS (HEAT EXCHANGE); HEAT EXCHANGERS; HEAT TRANSFER COEFFICIENTS; JETS; NATURAL CONVECTION; SPREADERS; TEMPERATURE CONTROL; THERMAL VARIABLES MEASUREMENT; THREE DIMENSIONAL;

PHASE INTERFACES;

EID: 77952638325     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2010.5444316     Document Type: Conference Paper

References (24)

1. Pinjala, D., M. K. Iyer, C. S. Guan, I. J. Rasiah, "Thermal characterization of vias using compact models", Proc of EPTC 2000, pp. 144-147, 2000.
2. Kleiner, M. B., S. A. Kuhn, P. Ramm, W. Weber, "Thermal Analysis of Vertically Integrated Circuits", International Electron Devices Meeting 1995 Technical Digest, pp. 487-490, 1995.
3. Im, S., K. Banerjee, "Full Chip Thermal Analysis of Planar (2-D) and Vertically Integrated (3-D) High Performance ICs", International Electron Devices Meeting, 2000 Technical Digest, pp. 727-730, 2000. (Pubitemid 32370951)
4. Akturk, A., N. Goldsman, G. Metze, "Coupled simulation of device performance and heating of vertically stacked three-dimensional integrated circuits", International Conference on Simulation of Semiconductor Processes and Devices, pp. 115-118, 2005. (Pubitemid 46016332)
5. Akturk, A., N. Goldsman, G. Metze, "Self-consistent modeling of heating and MOSFET performance in 3-D integrated circuits", IEEE Transactions on Electron Devices, Vol. 52, No. 11, pp. 2395 - 2403, 2005. (Pubitemid 41594869)
6. Goplen B., S. Sapatnekar, "Efficient thermal placement of standard cells in 3D ICs using a force directed approach", International Conference on Computer Aided Design, pp. 86-89, 2003.
7. Brunschwiler, T., B. Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, H. Reichl, "Forced Convective Interlayer Cooling in Vertically Integrated Packages", Proc of ITHERM 2008, pp. 1114-1125, 2008.
8. Sekar D., C. King, B. Dang, T. Spencer, H. Thacker, P. Joseph, M. Bakir, J. Meindl, "A 3D-IC technology with integrated microchannel cooling", Proc of IEEE International Interconnect Technology Conference, pp. 13-15, 2008.
9. Koo, J., S. Im, L. Jiang, K. E. Goodson, "Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures", J. Heat Transfer, Vol. 127, No. 1, pp. 49-58, 2005. (Pubitemid 40383008)
10. Bar-Cohen, A., K. Geisler, E. Rahim, "Pool and Flow Boiling in Narrow Gaps - Application to 3D Chip Stacks", Proc of Fifth European Thermal-Sciences Conference, 2008.
11. Wroblewski, D. E., Y. Joshi, "Liquid Immersion Cooling of a Substrate-Mounted Protrusion in a Three-Dimensional Enclosure: The effects of Geomotry and Boundary Conditions", J. of Heat Tran, Vol. 116, pp. 112-119, 1994.
12. Joshi, Y., M.D. Kelleher, M. Powell, E. I. Torres, "Natural Convection Heat Transfer from an Array of Rectangular Protrusions in an Enclosure Filled with Dielectric Liquid", J. of Electronics Packaging, Vol. 116, pp. 138-147, 1994.
13. Heindel, T. J., S. Ramadhyani, F. P. Incropera, "Conjugate Natural Convection from an Array of Discrete Heat Sources: Part 1 - Two- and Three-Dimensional Model Validation", Int. J. Heat and Fluid Flow, Vol. 16, pp. 501-510, 1995.
14. Heindel, T. J., S. Ramadhyani, F.P. Incropera, "Conjugate Natural Convection from an Array of Discrete Heat Sources: Part 2 - A Numerical Parametric Study", Int. J. Heat and Fluid Flow, Vol. 16, pp. 511-518, 1995.
15. Tou, S. K.W., C. P. Tso, X. Zhang, "3-D Numerical Analysis of Natural Conevctive Liquid Cooling of a 3x3 Heater Array in Rectangular Enclosures", Int. J. Heat Mass Tran., Vol. 42, pp. 3231-3244, 1999.
16. He, Y. L., W. W. Yang, W. Q. Tao, "Three-Dimensional Numerical Study of Natural Convective Heat Transfer of a Liquid in a Cubic Enclosure", Num. Heat Tran. A, Vol. 47, pp. 917-934, 2005.
17. Deng, Q-.H., G-.F. Tang, Y. Li, M.Y. Ha, "Interaction Between Discrete Heat Sources in Horizontal Natural Convection Enclosures", Int. J. Heat Mass. Tran., Vol. 45, pp. 5117-5132, 2002.
18. Bazylak, A., N. Djilali, D. Sinton, "Natural Convection in an Enclosure with Distributed Heat Sources", Num. Heat Tran. A, Vol. 49, pp. 655-667, 2006. (Pubitemid 43916366)
19. Gerlach, D.W., Y. K. Joshi, "Parametric thermal modeling of 3D stacked chip electronics with interleaved solid heat spreaders", The Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, ITHERM 06, pp. 1208-1212, 2006
20. Incropera, F. P. et al, Introduction to Heat Transfer, 4th Ed., John Wiley & Sons, Inc., (New York, 2002).
21. COMSOL Multiphysics Modeling Package, ver. 3.5a, 1998-2009, URL: http://www.comsol.com.
22. Gerty, D., D.W. Gerlach, Y.K. Joshi, A. Glezer, "Development of a Prototype Thermal Management Solution for 3-D Stacked Chip Electronics by Intervealed Solid Spreaders and Synthetic Jets", THERMINIC 2007, 2007.
23. www.3m.com
24. www.aremco.com