Parametric thermal modeling of 3D stacked chip electronics with interleaved solid heat spreaders

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1208-1212

  Gerlach, David W ^a   Joshi, Yogendra K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Heat conduction; IC; Integrated circuit; Simulation; Thermal management; Three dimensional

Indexed keywords

POWER DISSIPATIONS; SOLID HEAT SPREADERS; STACKED CHIPS;

COMPUTER SIMULATION; ELECTRONICS ENGINEERING; ENERGY DISSIPATION; HEAT TRANSFER COEFFICIENTS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

FLIP CHIP DEVICES;

EID: 33845585321     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645482     Document Type: Conference Paper

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