Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets

Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Volumn , Issue , 2007, Pages 156-161

  Gerty, Donavon ^a   Gerlach, David W ^a   Joshi, Yogendra K ^a   Glezer, Ari ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE LAYERS; AMBIENT AIR; CHIP ELECTRONICS; CO-EFFICIENT OF THERMAL EXPANSION; COMPUTATIONAL STUDIES; COOLING AIR; COPPER HEAT SPREADER; COPPER LAYERS; EXPERIMENTAL TESTING; FIN HEIGHT; HEAT SINK DESIGN; HEAT SPREADERS; HEAT TRANSFER CO-EFFICIENT; HIGH-THERMAL CONDUCTIVITY; LARGE HOLES; MULTILAYER STACKING; NEW DESIGN; PARTICLE-IMAGE VELOCIMETRY; POWER DISSIPATIONS; SYNTHETIC JETS; THERMAL MANAGEMENT; THERMAL PERFORMANCE; VELOCITY FIELDS; VIA HOLES;

AIR; COOLING; COPPER; FINS (HEAT EXCHANGE); FLOW VISUALIZATION; HEAT SINKS; HEAT STORAGE; HEAT TRANSFER; HEATING EQUIPMENT; JETS; MIXED CONVECTION; NONMETALS; SILICON; SPREADERS; THERMAL CONDUCTIVITY; THERMAL SPRAYING; THERMOANALYSIS; THERMOCOUPLES; THERMOELECTRICITY; THREE DIMENSIONAL;

THERMAL EXPANSION;

EID: 48049096844     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2007.4451769     Document Type: Conference Paper

References (17)

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