Optimization of thermal assisted direct bonding of soda-lime glasses for lab-on chip application

Microsystem Technologies

Volumn 16, Issue 4, 2010, Pages 527-532

  Chen, Qiuping ^a   Chen, Qiuling ^a   Ferraris, Monica ^a  

^a POLITECNICO DI TORINO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

BEFORE AND AFTER; BONDING STRENGTH; CLEANING EFFICIENCY; CLEANING SOLUTION; DIRECT BONDING; LAB ON CHIP; SODA LIME GLASS; SURFACE ETCHING; SURFACE QUALITIES; VOLUME RATIO;

ATOMIC FORCE MICROSCOPY; GLASS; GLASS BONDING; LIME; OPTICAL MICROSCOPY; OPTIMIZATION; SURFACE TREATMENT; TENSILE STRENGTH;

SURFACE CLEANING;

EID: 77952551781     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-010-1025-9     Document Type: Article

References (17)

1. Chen Q, Milanese D, Chen Q, Ferraris M et al (2005) Direct bonding and ion exchange for waveguide lossless splitter fabrication. ICG/ISG 2005, p5
2. Chen Q, Chen Q, Milanese D, Ferraris M, Fokine M (2007) Direct bonding and imprinting techniques for micro-fluidic devices fabrication in commercial soda-lime glass, Patent No. TO2007A000345
3. Chen Q, Milanese D, Chen Q, Ferraris M et al (2008) Fabrication and direct bonding of photosensitive multi-component silicate glasses for lossless planar waveguide splitter. J Non-Cryst Solids 354:1230-1234. doi:10.1016/j.jnoncrysol.2006.11.045
4. Chen Q, Chen Q, Milanese D, Ferraris M (2009) Micro-structures fabrication on glasses for micro-fluidics by imprinting technique. J Microsys Technol (in press)
5. Fung CD, Cheung PW, Ko WH, Fleming DG (1985) Micromachining and micropackaging of transducers. Elsevier, Amsterdam, p 41
6. Gui C, Albers H, Gardeniers JGE (1997) Fusion bonding of rough surfaces with polishing technique for silicon. J Microsys Technol 122-128
7. Guu YH (2005) AFM surface imaging of AISI D2 tool steel machined by the EDM process. Appl Surf Sci 242(3-4):245-250
8. Guu YH, Hocheng H (2001) High cycle fatigue of electricaldischarge machined AISI D2 tool steel. J Mater Prod Technol 16(6-7):642. doi:10.1504/IJMPT.2001.001286
9. Haisma J, Gijsbertus ACMS, Theo MM (1995) Surface preparation and phenomenological aspects of direct bonding. Philipp J Res 49:23-46
10. Imran F, Erwin B, Rik D (2005) Bonding strength tests between silicon wafers and duran tubes. Actuator Microsys, pp 936-939
11. Kutchoukov VG, Laugere F, van der Vlist W (2004) Fabrication of nanofluidic devices using glass-to-glass anodic bonding. J Non Cryst Solids, Sens Actuator A 114:521-527
12. Lee DJ, Byeong KJ, Jin J (1999) Effects of a hydrophilic surface in anodic bonding. J Micromech Microeng 9:313-318
13. Mitsushi I, Frederick WK Jr, Masayuki M et al (1993) Particle removal from silicon wafer surface in wet cleaning process. IEEE Trans Semicond Man 6:3
14. Plobi A et al (1999) Wafer direct bonding: tailoring adhesion between brittle materials. Mater Sci Eng R25(1-2):1-88
15. Qin-Yi T, Ulrich MG (1999) Wafer bonding and layer splitting for microsystems. J Adv Mater 17:1409-1425
16. Sayah A, Solignac D, Cueni T (2000) Development of novel low temperature bonding technologies for microchip chemical analysis applications. J App Phys Sens Actuator 84:103-108
17. Tung WH (1998) The relationship between white layer and residual stress induced by edm hole-drilling. Dissertation, National Cheng Kung University, Taiwan