The evaluation of the new composite lead free solders with the novel fabricating process

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability

Volumn , Issue , 2004, Pages 50-56

  Wang, L ^a   Yu, D Q ^a   Han, S Q ^a   Ma, H T ^a   Xie, H P ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Composite; Lead free solder; Microstructure; Shear strength; Sn Ag Cu; Wetting; Y2O3

Indexed keywords

COMPOSITE MATERIALS; FABRICATION; LEAD ALLOYS; MICROSTRUCTURE; SHEAR STRENGTH; TIN ALLOYS; WETTING; YTTRIUM COMPOUNDS;

LEAD FREE SOLDERS; REINFORCEMENT PARTICLES; SN-AG-CU; Y2O3;

SOLDERING ALLOYS;

EID: 4544325231     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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