3D GPU architecture using cache stacking: Performance, cost, power and thermal analysis

Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors

Volumn , Issue , 2009, Pages 254-259

  Ahmed, Al Maashri ^a   Sun, Guangyu ^a   Dong, Xiangyu ^a   Narayanan, Vijay ^a   Xie, Yuan ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D TECHNOLOGY; COMMUNICATION BANDWIDTH; CYCLE TIME; GEOMETRIC MEAN; GRAPHICS PROCESSING UNITS; PROCESSING POWER; STACKING TECHNOLOGY; THERMAL ANALYSIS;

ARCHITECTURAL DESIGN; COMPUTER CRIME; COMPUTER GRAPHICS EQUIPMENT; PROGRAM PROCESSORS; TELECOMMUNICATION SYSTEMS; THERMOANALYSIS; THREE DIMENSIONAL;

COST BENEFIT ANALYSIS;

EID: 77951019767     PISSN: 10636404     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCD.2009.5413147     Document Type: Conference Paper

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