Uniformity requirements for electroplated cu-sn interconnects used in heterogeneous 3-D MEMS/ASIC stacks

IMAPS Nordic Annual Conference 2008

Volumn , Issue , 2008, Pages 170-173

  Liu, H ^a   Husa, E M ^a   Ramic, Z ^a   Munding, A ^a   Aasmundtveit, K ^a   Hoivik, N ^a  

^a UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

Author keywords

Electroplating; Interconnects; MEMS; Micro bumps; SiP; Uniformity

Indexed keywords

3-D MEMS; BOND QUALITY; BONDING PROCESS; DEPOSITED METAL; HETEROGENEOUS INTEGRATION; MASK OPENING; MICRO-BUMPS; SEALING RING; SIP; SYSTEM IN A PACKAGES; UNIFORMITY;

INTEGRATION; INTERNET PROTOCOLS; MEMS; OPTICAL INTERCONNECTS; OPTIMIZATION; THREE DIMENSIONAL COMPUTER GRAPHICS;

ELECTROPLATING;

EID: 84872507869     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. S. Stoukatch, C. Winters, E. Beyne, W. De Raedt, and V. Hoof, "3D-SIP integration for autonomous sensor nodes," Proceedings of the 56th Electronic Components and Technology Conference. IEEE, pp. 404-408, 2006.
2. N. Marenco, S. Warnat, and W. Reinert, "Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems," Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2007.
3. K. N. Tu, "Interdiffusion and reaction in bimetallic Cu-Sn thin films," Acta Metallurgica, vol. 21, pp. 347-354, 1973.
4. R. A. Gagliano and M. E. Fine, "Thickening kinetics of interfacial Cu6Sn5 and Cu3Sn layers during reaction of liquid tin with solid copper," Journal of Electronic Materials, vol. 32, pp. 1441-1447, Dec 2003.
5. H. Huebner, S. Penka, B. Barchmann, M. Eigner, W. Gruber, M. Nobis, S. Janka, G. Kristen, and M. Schneegans, "Microcontacts with sub-30 [mu]m pitch for 3D chip-on-chip integration," Microelectronic Engineering, vol. 83, pp. 2155-2162, 2006.
6. H. Huebner, O. Ehrmann, M. Eigner, W. Gruber, A. Klumpp, R. Merkel, P. Ramm, M. Roth, J. Weber, and R. Wieland, "Face-to-Face Chip Integration with Full Metal Interface," Advanced Metallisation Conference 2002 (AMC 2002), vol. 18, pp. 53-58, 2002.
7. F. Bartels, J. W. Morris, G. Dalke, and W. Gust, "Intermetallic Phase-Formation in Thin SolidLiquid Diffusion Couples," Journal of Electronic Materials, vol. 23, pp. 787-790, Aug 1994.