Fluxless bonding of Si chips to Ag-copper using electroplated indium and silver structures

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2007, Pages 199-204

  Kim, Jong S ^a   Wang, Pin J ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; SILICON; SILVER;

ELECTROPLATED INDIUM; SILVER STRUCTURES;

MICROPROCESSOR CHIPS;

EID: 44449102256     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2007.4419940     Document Type: Conference Paper

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