Au-Sn SLID bonding: Fluxless bonding with high temperature stability, to above 350°C

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Aasmundtveit, Knut E ^a   Wang, Kaiying ^a   Hoivik, Nils ^a   Graff, Joachim M ^b   Elfving, Anders ^c  

^a UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

^b SINTEF MATERIALS AND CHEMISTRY   (Norway)

^c SensoNor   (Norway)

Author keywords

3D integration; Au; Electroplating; Fluxless bonding; High temperature applications; Sn

Indexed keywords

3-D INTEGRATION; AU ELECTROPLATING; BOND LINE; BONDING PROCESS; CHEMICAL SURFACES; DECOMPOSITION TEMPERATURE; EDS ANALYSIS; EUTECTIC POINTS; FLUXLESS; FLUXLESS BONDING; HIGH MELTING POINT; HIGH TEMPERATURE STABILITY; INTER DIFFUSION; INTERMETALLIC COMPOUNDS; LAYERED STRUCTURES; MELTING TEMPERATURES; METAL SYSTEMS; OXIDATION RESISTANT; ROOM TEMPERATURE; SHEAR FORCE; SOLID-LIQUID;

EUTECTICS; HIGH TEMPERATURE APPLICATIONS; INTERMETALLICS; MELTING POINT; MICROELECTRONICS; PHASE DIAGRAMS; SMELTING; STEEL SHEET; STEELMAKING; SURFACE TREATMENT; SYSTEM STABILITY; THREE DIMENSIONAL; TIN; TIN ALLOYS;

GOLD;

EID: 70449926635     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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