The Influence of H2S exposure on immersion-silver-finished pcbs under mixed-flow gas testing

IEEE Transactions on Device and Materials Reliability

Volumn 10, Issue 1, 2010, Pages 71-81

  Zhang, Shunong ^a   Osterman, Michael ^b   Shrivastava, Anshul ^b   Kang, Rui ^a   Pecht, Michael G ^b,c  

^a BEIHANG UNIVERSITY   (China)

^b UNIVERSITY OF MARYLAND   (United States)

^c CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Corrosion; H2S environment; Immersion silver (ImAg) printed circuit board (PCB); Mixed flow gas (MFG) test

Indexed keywords

H2S ENVIRONMENT; IMMERSION SILVER; MIXED FLOW GAS (MFG) TEST; MIXED FLOWS;

ATMOSPHERIC HUMIDITY; CORROSION; DENDRITES (METALLOGRAPHY); GASES; MOISTURE; PRINTED CIRCUIT MANUFACTURE; SILVER; SOLDERING ALLOYS; TESTING;

PRINTED CIRCUIT BOARDS;

EID: 77949400100     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2009.2033194     Document Type: Article

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