Accelerated corrosion of printed circuit boards due to high levels of reduced sulfur gasses in industrial environments

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2006, Issue , 2006, Pages 469-473

  Mazurkiewicz, Paul ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION; DUST; HYDROGEN SULFIDE; SILVER PLATING; SULFUR;

IMMERSION SILVER PLATING; ORGANICALLY COATED COPPER (OCC); SULFUR GASES;

PRINTED CIRCUIT BOARDS;

EID: 33847653212     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Tullmin, M., "Tutorial Corrosion of Metallic Materials," IEEE Trans Rel, Vol. 44, No. 2 (1995), pp. 271-278.
2. Ibid, pp 274
3. Graedel, T.E. "Corrosion Mechanisms for Silver Exposed to the Atmosphere" J. Electrochem. Soc. Vol 139, No. 7, 1992pp. 1963-1970
4. Ibid, pp.1964
5. IEC 721-3-3 "International Standard Classification of Environmental Conditions Part 3" IEC 1994. pp 47
6. Graedel, T.E. "Corrosion Mechanisms for Silver Exposed to the Atmosphere" J. Electrochem. Soc. Vol 139, No. 7, 1992 pp.
7. http://europa.eu.int/eurlex/pri/en/oj/dat/2003/l_037/ l_03720030213en00190023. pdf see also http://en.wikipedia.org/wiki/ RoHS_Directive
8. http://www.chavant.com/ in Farmingdale, NJ
9. http://www.nema.org/prod/be/enclosures/
10. Chudnovsky, B.H. "Degradation of Power Contacts in Industrial Atmosphere: Silver Corrosion and Whiskers" Proceeding of the Forty-Eight IEEE Holm converence on Electrical Contacts, 2002, p 140-150.
11. www.hp.com type "remote graphics" in the search box