The influence of SO2 environments on immersion silver finished PCBs by mixed flow gas testing

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 116-122

  Zhang, Shunong ^a   Shrivastava, Anshul ^b   Osterman, Michael ^b   Pecht, Michael ^b,c   Kang, Rui ^a  

^a BEIHANG UNIVERSITY   (China)

^b UNIVERSITY OF MARYLAND   (United States)

^c CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL CORROSION; CORROSION PRODUCTS; ELECTRODE REACTIONS; EXPOSURE TIME; GAS CHAMBERS; GAS ENVIRONMENT; HIGH HUMIDITY; IMMERSION SILVER; LAND PATTERNS; LOW HUMIDITY; MIXED FLOWS; PASSIVE FILMS; RELATIVE HUMIDITIES; TEST CONDITION;

ATMOSPHERIC HUMIDITY; COPPER COMPOUNDS; COPPER OXIDES; CORROSION; ELECTRONICS PACKAGING; MOISTURE; PACKAGING; PRINTED CIRCUIT MANUFACTURE; SILVER;

PRINTED CIRCUIT BOARDS;

EID: 70449981484     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270782     Document Type: Conference Paper

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