Reliability assessment of immersion silver finished circuit board assemblies using clay tests

Proceedings of 2009 8th International Conference on Reliability, Maintainability and Safety, ICRMS 2009

Volumn , Issue , 2009, Pages 1212-1216

  Zhou, Yilin ^a   Pecht, Michael ^b  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

^b Electronic Products   (United States)

Author keywords

Creep corrosion; Immersion silver; Sulfur; Weibull distribution

Indexed keywords

CIRCUIT BOARDS; COPPER TRACES; CORROSION PRODUCTS; GALVANIC CORROSION; IMMERSION SILVER; RELATIVE LOCATION; RELIABILITY ASSESSMENTS; SILVER SULFIDES; SOLDER MASK; SULFUR ENVIRONMENTS; SURFACE FINISHES; TWO PARAMETER; WEIBULL;

CORROSION RESISTANCE; CREEP; MAINTAINABILITY; PRINTED CIRCUIT MANUFACTURE; RELIABILITY ANALYSIS; SILVER COMPOUNDS; SOLDERING ALLOYS; SULFUR; WEIBULL DISTRIBUTION;

PRINTED CIRCUIT BOARDS;

EID: 77955939782     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICRMS.2009.5270038     Document Type: Conference Paper

References (10)

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