메뉴 건너뛰기




Volumn 158, Issue 2, 2010, Pages 198-206

The warm-up and offset stability of a low-pressure piezoresistive ceramic pressure sensor

Author keywords

Finite element analysis; LTCC; Offset stability; Thick film piezoresistive sensor; Warm up drift

Indexed keywords

CERAMIC PRESSURE SENSORS; DESIGN PARAMETERS; EXPERIMENTAL TEST; FINITE-ELEMENT ANALYSIS; HIGHER RESOLUTION; LIQUID PRESSURE; LOW PRESSURES; LOW YOUNG'S MODULUS; LOW-TEMPERATURE CO-FIRED CERAMIC MATERIALS; MECHANICAL STRENGTH; MINIATURISATION; OFFSET VOLTAGE; PIEZO-RESISTIVE; PIEZORESISTIVE SENSORS; PRESSURE RANGES; PROCESSING PARAMETERS; SENSOR CHARACTERISTICS; THIN SHEET; THREE-DIMENSIONAL STRUCTURE;

EID: 77949340360     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.12.035     Document Type: Article
Times cited : (32)

References (18)
  • 3
    • 33847351187 scopus 로고    scopus 로고
    • Fabrication of a millinewton force sensor using low temperature co-fired ceramic (LTCC) technology
    • Birol H., Maeder T., Nadzeyka I., Boers M., and Ryser P. Fabrication of a millinewton force sensor using low temperature co-fired ceramic (LTCC) technology. Sens. Actuators A 134 (2007) 334-338
    • (2007) Sens. Actuators A , vol.134 , pp. 334-338
    • Birol, H.1    Maeder, T.2    Nadzeyka, I.3    Boers, M.4    Ryser, P.5
  • 7
    • 75449107380 scopus 로고    scopus 로고
    • Development of LTCC-materials and their application-an overview
    • Kita J., and Moos R. Development of LTCC-materials and their application-an overview. Informacije MIDEM 38 4 (2008) 219-224
    • (2008) Informacije MIDEM , vol.38 , Issue.4 , pp. 219-224
    • Kita, J.1    Moos, R.2
  • 9
    • 35548947939 scopus 로고    scopus 로고
    • Finite-element model-based fault diagnosis, a case study of a ceramic pressure sensor structure
    • Zarnik M.S., Belavič D., and Novak F. Finite-element model-based fault diagnosis, a case study of a ceramic pressure sensor structure. Microelectron. Reliab. 47 12 (2007) 1950-1957
    • (2007) Microelectron. Reliab. , vol.47 , Issue.12 , pp. 1950-1957
    • Zarnik, M.S.1    Belavič, D.2    Novak, F.3
  • 10
    • 4544316034 scopus 로고    scopus 로고
    • Residual stresses in a pressure-sensor package induced by adhesive material during curing: a case study
    • Zarnik M.S., Ročak D., and Maček S. Residual stresses in a pressure-sensor package induced by adhesive material during curing: a case study. Sens. Actuators A 116 (2004) 442-449
    • (2004) Sens. Actuators A , vol.116 , pp. 442-449
    • Zarnik, M.S.1    Ročak, D.2    Maček, S.3
  • 12
    • 10244232785 scopus 로고    scopus 로고
    • A procedure for validating the finite element model of a piezoresistive ceramic pressure sensor
    • Zarnik M.S., Belavic D., Friedel K.P., and Wymyslowski A. A procedure for validating the finite element model of a piezoresistive ceramic pressure sensor. IEEE Trans. Comp. Pack. Technol. 27 4 (2004) 668-675
    • (2004) IEEE Trans. Comp. Pack. Technol. , vol.27 , Issue.4 , pp. 668-675
    • Zarnik, M.S.1    Belavic, D.2    Friedel, K.P.3    Wymyslowski, A.4
  • 13
    • 33751271370 scopus 로고    scopus 로고
    • Evaluation of gauge coefficients for modelling piezoresistive properties of thick-film resistors
    • Zarnik M.S., Belavič D., and Wymyslowski A. Evaluation of gauge coefficients for modelling piezoresistive properties of thick-film resistors. Sens. Mater. 18 5 (2006) 261-275
    • (2006) Sens. Mater. , vol.18 , Issue.5 , pp. 261-275
    • Zarnik, M.S.1    Belavič, D.2    Wymyslowski, A.3
  • 14
    • 84878215538 scopus 로고    scopus 로고
    • Benchmarking different types of thick-film pressure sensors
    • Proceedings of the International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)
    • Belavič D., Zarnik M.S., Hrovat M., Maček S., Pavlin M., Jerlah M., Holc J., Drnovšek S., Cilenšek J., and Kosec M. Benchmarking different types of thick-film pressure sensors. Proceedings of the International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT). Denver, CO (2007) 278-285
    • (2007) Denver, CO , pp. 278-285
    • Belavič, D.1    Zarnik, M.S.2    Hrovat, M.3    Maček, S.4    Pavlin, M.5    Jerlah, M.6    Holc, J.7    Drnovšek, S.8    Cilenšek, J.9    Kosec, M.10
  • 16
    • 32544443473 scopus 로고    scopus 로고
    • Simultaneous estimation of heat transfer coefficient and thermal conductivity with application to microelectronic materials
    • Zawada T. Simultaneous estimation of heat transfer coefficient and thermal conductivity with application to microelectronic materials. Microelectron. J. 37 (2006) 340-352
    • (2006) Microelectron. J. , vol.37 , pp. 340-352
    • Zawada, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.