An evaluation of the influence of temperature on the characteristics of capacitive, resonant and piezoresistive thick-film pressure sensors

4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008

Volumn , Issue , 2008, Pages 553-559

  Belavič, Darko ^a,b   Zarnik, Marina Santo ^a,b   Hrovat, Marko ^b   Jerlah, Mitja ^a,c   Maček, Srečko ^b   Pavlin, Marko ^a,c   Holc, Janez ^b   Kocjan, Sandi ^a,c  

^a HIPOT RandD   (Slovenia)

^b JO EF STEFAN INSTITUTE   (Slovenia)

^c doo   (Slovenia)

Author keywords

Pressure sensors; Sensors; Temperature characteristics; Thick film

Indexed keywords

CAPACITANCE VALUES; LOW-TEMPERATURE CO-FIRED CERAMICS; PIEZORESISTIVE PRESSURE SENSORS; RESONANT PRESSURE SENSORS; STATIC DEFLECTIONS; TEMPERATURE CHARACTERISTIC; TEMPERATURE DEPENDENCE; THICK FILM RESISTORS;

CERAMIC MATERIALS; DIAPHRAGMS; MICROELECTRONICS; MICROSYSTEMS; NATURAL FREQUENCIES; PIEZOELECTRIC ACTUATORS; RESISTORS; SENSORS;

PRESSURE SENSORS;

EID: 84880108625     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)

1. M. Pavlin, D. Belavič, M. Santo Zarnik, M. Hrovat, M. Možek, Packaging technologies for pressure-sensors. Microelectron. int., 2002, vol. 19, pp. 9-13.
2. N. Maluf, K. Williams, "An Introduction to Microelectromechanical System Engineering", Artech House, Inc., Norwood, 2004.
3. T. Thelemann, H. Thust, M. Hintz, "Using LTCC for microsystems", Microelectronics International, Vol. 19, No. 3, pp. 19-23, 2002.
4. D. Belavič, M. Hrovat, M. Pavlin, M. Santo Zarnik, "Thick-film technology for Sensor Applications", Informacije MIDEM, Vol. 33, pp. 45-48, 2003.
5. L.J. Golonka, A. Dziedzic, J. Kita, T. Zawada, "LTCC in microsystem application", Informacije MIDEM, Vol. 32, No. 4, pp. 272-279, December 2002.
6. th European Microelectronics and Packaging Conference, Frieddrichshafen, Germany, pp. 133-104, 2003.
7. A. Wymyslowski, M. Santo Zarnik, D. Belavič, "Sequential approach to numerical optimization of the LTCC ceramic pressure sensor", Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in MicroElectronics and Microsystems, April 18-20, Berlin, Germany, pp. 376-383, 2005.
8. th European Microelectronics and Packaging Symposium with Table-Top Exhibition, Terme Čatež, Slovenia, str. 271-282, May 21-24, 2006.
9. R. Puers, "Capacitive sensors; when and how to use them", Sensors and Actuators A, Vol. 37, pp. 93-105, 1993.
10. M. Yamada, T. Takebayashi, S. I. Notoyama, K. Watanabe, "A Switched-Capacitor Interface for Capacitive Pressure Sensors", IEEE Transactions on Instrumentation and Measurement, Vol. 41, No. 1, pp. 81-86, February 1992.
11. C. B. Sippola, C. H. Ahn, "A thick film screen-printed ceramic capacitive pressure microsensor for high temperature applications", Journal of Micromechanics and Microengineering, Vol. 16, pp. 1086-1091, 2006.
12. J.I. Pavlič, M. Santo Zarnik, D. Belavič, "Feasibility study of a ceramic capacitive pressure sensor", Proceedings. Ljubljana: MIDEM - Society for Microelectronics, Electronic Components and Materials, pp. 95-100, 2006.
13. D. Belavič, M. Santo Zarnik, M. Jerlah, M. Pavlin, M. Hrovat, S. Maček, "Capacitive thick-film pressure sensor: material and construction investigation", Proceedings of the XXXI International Conference of IMAPS Poland 2007, Rzeszóv, Krasiczyn, Poland, pp. 249-253, September 23-26, 2007.
14. D. Belavič, M. Santo Zarnik, M. Hrovat, J. Holc, M. Kosec, S. Maček, M. Jerlah, J. Bernard, M. Pavlin, H. Uršič, An investigation of thick-film technology for sensors and actuators in C-MEMS. Proceedings of the XXX International Conference of IMAPS Poland Chapter, Krakow, Poland, pp. 21-28, September 24-27, 2006.
15. rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, Colorado, USA, pp. 278-285, April 23-26, 2007.
16. th European Microelectronics and Packaging Conference, Strasbourg, France, pp. 103-108, 2001.
17. M. Hrovat, D. Belavič, Z. Samardzija, J. Holc, "A characterisation of thick film resistors for strain gauge applications", Journal of Materials Science, Vol. 36, No. 11, pp. 2679-2689, 2001.
18. M. Hrovat, D. Belavič, Z. Samardzija, J. Holc, A characterisation of thick film resistors for strain gauge applications, Journal of Materials Science, No. 36, pp. 2679-2689, 2001.
19. C. Grimaldi, T. Maeder, P. Ryser, S. Strässler, "Critical behaviour of the piezoresistive response in RuO2-glass composites", Journal of Physics D: Applied Physics, Vol. 36, pp. 1341-1348, 2003.
20. C. Grimaldi, S. Vionnet-Menot, T. Maeder, P. Ryser, "Effect of Composition and Microstructure on the Transport and Piezoresistive Properties of Thick-film Resistors", Proceedings of the XXVIII International Conference of IMAPS Poland chapter, Wroclaw, Poland, pp. 35-42, 2004.
21. rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, Colorado, USA, pp. 367-372, April 23-26, 2007.