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Volumn 26, Issue 3, 2010, Pages 253-261

Grain boundary engineering: An overview after 25 years

Author keywords

Grain boundary engineering; Grain boundary plane; Grain boundary structure; Intergranular corrosion; Intergranular cracking; Review; Twinning

Indexed keywords

GRAIN BOUNDARY ENGINEERING; GRAIN BOUNDARY PLANE; GRAIN BOUNDARY STRUCTURE; INTERGRANULAR CORROSION; INTERGRANULAR CRACKING;

EID: 77749304288     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/026708309X12601952777747     Document Type: Review
Times cited : (232)

References (54)
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  • 26
    • 77749257439 scopus 로고    scopus 로고
    • MEng thesis, University of Michigan, MI, USA
    • J. A. Zelinski: MEng thesis, University of Michigan, MI, USA, 2005.
    • (2005)
    • Zelinski, J.A.1
  • 36
    • 84879114817 scopus 로고    scopus 로고
    • ( ed. A. J. Schwartz, M. Kumar, B. L. Adams and D. P. Field), 2nd edn, New York, Kluwer
    • B. Reed and C. A. Schuh: in 'Electron backscatter diffraction in materials science', (ed. A. J. Schwartz, M. Kumar, B. L. Adams and D. P. Field), 2nd edn, 201; 2009, New York, Kluwer.
    • (2009) Electron Backscatter Diffraction in Materials Science , vol.201
    • Reed, B.1    Schuh, C.A.2
  • 48
    • 77749279157 scopus 로고    scopus 로고
    • D. L. Limoges, G. Palumbo and P. K. Lin: US patent no. 6,344,097 B1, 2002.
    • D. L. Limoges, G. Palumbo and P. K. Lin: US patent no. 6,344,097 B1, 2002.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.