Changes in interface parameters and tensile properties in copper as a consequence of iterative processing

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 39, Issue 9, 2008, Pages 2175-2183

  Coleman, Mark ^a   Randle, Valerie ^a  

^a SWANSEA UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL GROWTH; GRAIN (AGRICULTURAL PRODUCT); GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; STRAIN HARDENING; TECHNOLOGY;

BOUNDARY PLANES; DISLOCATION PILEUP; EARLY STAGES; GRAIN BOUNDARY MIGRATIONS; GRAIN BOUNDARY MISORIENTATION; GRAIN BOUNDARY PLANES; GRAIN-BOUNDARY ENGINEERING; INTERFACE PARAMETERS; ITERATIVE PROCESSING; MICROSTRUCTURE EVOLUTIONS; RETENTION ABILITY; STRESS-STRAIN BEHAVIORS; TENSILE PROPERTIES; WORK-HARDENING;

HARDENING;

EID: 49049084022     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-008-9574-6     Document Type: Article

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