A study of low-strain and medium-strain grain boundary engineering

Acta Materialia

Volumn 57, Issue 11, 2009, Pages 3410-3421

  Randle, Valerie ^a   Coleman, Mark ^a  

^a SWANSEA UNIVERSITY   (United Kingdom)

Author keywords

Copper; Electron backscattering diffraction (EBSD); Grain boundary twin

Indexed keywords

DRIVING FORCES; ELECTRON BACKSCATTERING DIFFRACTION (EBSD); GRAIN BOUNDARY ENGINEERING; GRAIN BOUNDARY PLANE; HARDNESS MEASUREMENT; MIS-ORIENTATION; PROCESSING SCHEDULE;

BACKSCATTERING; COPPER; DEFORMATION; ELECTRON DIFFRACTION; ELECTRON SCATTERING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MECHANICAL PROPERTIES; STRAIN;

DATA PROCESSING;

EID: 65649140006     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.04.002     Document Type: Article

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