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Acta Materialia

Volumn 49, Issue 11, 2001, Pages 2065-2074

The flow stress behavior of OFHC polycrystalline copper

(5) Flinn, J E a Field, D P b Korth, G E c Lillo, T M c Macheret, J d

a UNIVERSITY OF IDAHO (United States)

b Washington State University (United States)

c IDAHO NATIONAL LABORATORY (United States)

d IDAHO NATIONAL LABORATORY (United States)

Author keywords

Copper; Dislocations; Grain boundaries; Stress strain relationship measurements; Transmission electron microscopy (TEM)

Indexed keywords

COLD ROLLING; DISLOCATIONS (CRYSTALS); GRAIN SIZE AND SHAPE; METAL EXTRUSION; PLASTIC FLOW; POLYCRYSTALLINE MATERIALS; STRESS ANALYSIS; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY;

ANGULAR EXTRUDED MATRIALS;

COPPER;

EID: 0035933651 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/S1359-6454(01)00102-1 Document Type: Article

Times cited : (66)

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