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Acta Materialia

Volumn 56, Issue 10, 2008, Pages 2363-2373

Five-parameter grain boundary distribution of commercially grain boundary engineered nickel and copper

(5) Randle, V a Rohrer, G S b Miller, H M b Coleman, M a Owen, G T a

a SWANSEA UNIVERSITY (United Kingdom)

b CARNEGIE MELLON UNIVERSITY (United States)

Author keywords

Electron backscatter diffraction; Grain boundary; Grain boundary plane; Grain boundary twin

Indexed keywords

COPPER; ELECTRON DIFFRACTION; GRAIN BOUNDARIES;

ELECTRON BACKSCATTER DIFFRACTION; GRAIN BOUNDARY PLANES; GRAIN BOUNDARY TWINS;

NICKEL;

EID: 43449103335 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2008.01.039 Document Type: Article

Times cited : (162)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.