-
1
-
-
0030388567
-
Cooling of electronics by heat pipes and thermosyphons: A review of methods and possibilities
-
B. Palm, N. Tengblad, Cooling of electronics by heat pipes and thermosyphons: a review of methods and possibilities, in: Proc. ASME National Heat Transfer Conference, HTD-329, 1996, pp. 97-108.
-
Proc. ASME National Heat Transfer Conference
, vol.HTD-329
-
-
Palm, B.1
Tengblad, N.2
-
2
-
-
0343167456
-
Choosing working fluid for two phase thermosyphon systems for cooling of electronics
-
B. Palm, R. Khodabandeh, Choosing working fluid for two phase thermosyphon systems for cooling of electronics, Advances in Electronic Packaging, ASME EEP-26 (2), 1999, pp. 1491-1498.
-
(1999)
Advances in Electronic Packaging, ASME
, vol.EEP-26
, Issue.2
, pp. 1491-1498
-
-
Palm, B.1
Khodabandeh, R.2
-
4
-
-
0032163130
-
Transient characteristics of a two-phase thermosyphon loop for multichip module
-
Nam S.-S., Choi S.-B., Kim J.-H., and Kwak H.-Y. Transient characteristics of a two-phase thermosyphon loop for multichip module. ETRI Journal 20 3 (1998) 284-300
-
(1998)
ETRI Journal
, vol.20
, Issue.3
, pp. 284-300
-
-
Nam, S.-S.1
Choi, S.-B.2
Kim, J.-H.3
Kwak, H.-Y.4
-
5
-
-
0030421140
-
Thermal characteristics of two phase thermosyphon cooling module for multi chip device
-
Choi S.B., Nam S.S., Kim J.H., and Kwak H.Y. Thermal characteristics of two phase thermosyphon cooling module for multi chip device. Advances in Energy Efficiency ASME HTD-338 (1996) 33-43
-
(1996)
Advances in Energy Efficiency
, vol.ASME HTD-338
, pp. 33-43
-
-
Choi, S.B.1
Nam, S.S.2
Kim, J.H.3
Kwak, H.Y.4
-
7
-
-
85047700495
-
Experimental study on closed-loop two-phase thermosyphon devices for cooling MCMs
-
Na M.-K., Jeon J.-S., and Kwak H.-Y. Experimental study on closed-loop two-phase thermosyphon devices for cooling MCMs. Heat Transfer Engineering 22 2 (2001) 29-39
-
(2001)
Heat Transfer Engineering
, vol.22
, Issue.2
, pp. 29-39
-
-
Na, M.-K.1
Jeon, J.-S.2
Kwak, H.-Y.3
-
8
-
-
13444251174
-
Parametric investigation of a graphite foam evaporator in a thermosyphon with fluorinert and a silicon CMOS chip
-
Klett J.W., and Trammell M. Parametric investigation of a graphite foam evaporator in a thermosyphon with fluorinert and a silicon CMOS chip. IEEE Transactions on Device and Materials Reliability 4 3 (2004) 626-637
-
(2004)
IEEE Transactions on Device and Materials Reliability
, vol.4
, Issue.3
, pp. 626-637
-
-
Klett, J.W.1
Trammell, M.2
-
9
-
-
22944456849
-
Performance of graphite foam evaporator for use in thermal management
-
Coursey J.S., Kim J., and Boudreaux P.J. Performance of graphite foam evaporator for use in thermal management. Journal of Electronic Packaging 127 (2005) 127-134
-
(2005)
Journal of Electronic Packaging
, vol.127
, pp. 127-134
-
-
Coursey, J.S.1
Kim, J.2
Boudreaux, P.J.3
-
10
-
-
78249270095
-
-
J.S. Coursey, H. Roh, J. Kim, P.J. Boudreaux, Graphite foam thermosyphon evaporator performance: parametric investigation of the effects of working fluid, liquid level and chamber pressure, in: Proc. 2002, ASME IMECE Paper No. 2002-33733, 2002.
-
J.S. Coursey, H. Roh, J. Kim, P.J. Boudreaux, Graphite foam thermosyphon evaporator performance: parametric investigation of the effects of working fluid, liquid level and chamber pressure, in: Proc. 2002, ASME IMECE Paper No. 2002-33733, 2002.
-
-
-
-
11
-
-
61449096908
-
Experimental investigation of the thermal performance of graphite foam for evaporator enhancement in both pool boiling and an FC-72 thermosyphon
-
Gandikota V., and Fleischer A.S. Experimental investigation of the thermal performance of graphite foam for evaporator enhancement in both pool boiling and an FC-72 thermosyphon. Heat Transfer Engineering 30 8 (2009) 643-648
-
(2009)
Heat Transfer Engineering
, vol.30
, Issue.8
, pp. 643-648
-
-
Gandikota, V.1
Fleischer, A.S.2
-
12
-
-
77649231635
-
-
G.F. Jones, B.J. Sullivan, A carbon fiber, air-cooled heat exchanger for high performance electronic cooling, in: Proc. 6th ASME-JSME Thermal Engineering Joint Conference, ASME Paper No. TED-AJ03-136, Hawaii Island, Hawaii, 2003.
-
G.F. Jones, B.J. Sullivan, A carbon fiber, air-cooled heat exchanger for high performance electronic cooling, in: Proc. 6th ASME-JSME Thermal Engineering Joint Conference, ASME Paper No. TED-AJ03-136, Hawaii Island, Hawaii, 2003.
-
-
-
-
13
-
-
4444243395
-
Spacing of high-brightness LEDs on metal substrate PCBs for proper thermal performance
-
June 1-4, Las Vegas, NV
-
J. Petrowski, Spacing of high-brightness LEDs on metal substrate PCBs for proper thermal performance, in: Proc. of the 2004 Intersociety Conference on Thermal Phenomena, June 1-4, Las Vegas, NV, 2004, pp. 507-514.
-
(2004)
Proc. of the 2004 Intersociety Conference on Thermal Phenomena
, pp. 507-514
-
-
Petrowski, J.1
-
14
-
-
0002477246
-
Describing uncertainty in single-sample experiments
-
Kline S.J., and McClintock F.A. Describing uncertainty in single-sample experiments. Mechanical Engineering 75 (1953) 3-8
-
(1953)
Mechanical Engineering
, vol.75
, pp. 3-8
-
-
Kline, S.J.1
McClintock, F.A.2
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