Choosing working fluid for two phase thermosyphon systems for cooling of electronics

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Palm, Björn ^a   Khodabandeh, Rahmatollah ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; HEAT FLUX; HEAT LOSSES; HEAT TRANSFER COEFFICIENTS; HIGH PRESSURE EFFECTS; PRESSURE DROP; SIPHONS; TWO PHASE FLOW;

THERMOSYPHON SYSTEMS; WORKING FLUIDS;

ELECTRONICS PACKAGING;

EID: 0343167456     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (25)

1. Bar-Cohen, A., 1993, "Thermal Management of Electronic Components with Dielectric Liquids", Int. J. JSME, Ser. B, Vol. 36, No. 1, pp. 1-25.
2. Bergles, A. E. and Bar-Cohen, A., 1990, "Direct Liquid Cooling of Microelectronic Components", Advances in Thermal Modeling of Electronic Components and Systems, Vol. 2, pp.233-342.
3. Collier, J. G., 1972, Convective Boiling and Condensation, 2:ed, McGraw-Hill.
4. Cooper, M. G., 1984, "Saturation Nucleate Pool Boiling. A Simple Correlation", Proc. 1st National Conference on Heat Transfer, Vol. 2, pp. 785-793, (I. Chem. E. Symp. Ser. No. 86).
5. Gorenflo, D., 1993, "Pool Boiling", in VDI Heat Atlas, VDI-Verlag GmbH, Dusseldorf, Germany, pp. Hal-13.
6. Gromoll, B., 1993, "Application and Performance of Si-Microcooling System for Electronic Devices", Proc. Eurotherm Seminar No. 29, Thermal Management of Electronic Systems, pp. 13-1-13-10.
7. Gromoll, B., 1994, "Advanced Micro Air Cooling Systems for High Density Packaging", Proc. 10th IEEE Semi-Therm Conference, pp. 53-58.
8. Guglielmini, G., Misale, M. and Schenone, C., 1993, "Pool Boiling Heat Transfer of Dielectric Fluids for Immersion Electronic Cooling: Effects of Pressure", Proc. Eurotherm Seminar No. 29, Thermal Management of Electronic Systems, pp. 15-1-15-10.
9. Hewitt, G. F., G.L. Shires and T. R. Bott, 1994, Process Heat Transfer, CRC Press/Begell House, ISBN 0-8493-9918-1.
10. Incropera, F. P., 1990, "Liquid Immersion Cooling of Electronic Components", in Heat Transfer in Electronic and Microelectronic Equipment, ed. A. E. Bergles, Hemisphere Publishing Corporation, pp. 407-444.
11. Kishimoto, T. and Harada A., 1992, "Two-phase Thermosyphon Cooling for Telecom Multichip Modules", in Advances in Electronic Packaging, Proc. 1992 Joint ASME/JSME Conf. on Electronic Packaging, Milpitas, USA, pp. 135-141.
12. Kishimoto, T., 1994, "Flexible-heat-pipe Cooling for High-Power Devices", Int. J. Microcircuits and Electronic Packaging, Vol. 17, No. 2, pp. 98-107.
13. Klein, S. A. and F. L. Alvarado, 1998, Engineering Equation Solver, Ver. 4.879, F-Chart Software, www.fChart.com.
14. Köberle, K. and Auracher, H., 1993, "Temperature Controlled Measurements of the Critical Heat Flux on Microelectronic Heat Sources in Natural Convection and Jet Impingement Cooling", Proc. Eurotherm Seminar No. 29, Thermal Management of Electronic Systems, pp. 14-1-14-10.
15. Kuwahara, H. et al., 1994, "Enhancement of Two-Phase Thermosyphon for Cooling High Heat Flux Power Devices", Proc. I-Therm IV, (InterSociety Conference on Thermal Phenomena in Electronic Systems), Washington DC, pp. 184-189.
16. Lienhard, J. H. and V. K. Dhir, 1973a, "Extended Hydrodynamic Theory of the Peak and Minimum Pool Boiling Heat Fluxes", Report CR-2270, National Aeronautics and Space Administration, Washington D. C.
17. Lienhard, J. H. and V. K. Dihr, 1973b, "Peak Boiling Heat Flux from Finite Bodies", Trans. ASME. J. Heat Transfer, Vol. 95, p. 152.
18. Liu, Z. and R. H. S. Winterton, 1990, "Wet Wall Flow Boiling Correlation with Explicit Nucleate Term", in Multiphase Transport and Particulate Phenomena", 1, (Ed. T. Nejat Veziroglu), pp. 419-432. Hemisphere Publ. Corp., New York.
19. Lombardi, C. and C. G. Carsana, 1992, "A Dimensionless Pressure Drop Correlation for Two-Phase Mixtures flowing Upflow in Vertical Ducts Covering Wide Parameter Range", Int. Journal of Heat and Technology, Vol. 10, No. 1-2, pp. 125-141.
20. Nakayama, W. and Bergles, A. E., 1990, "Cooling of Electronic Equipment: Past Present and Future", in Heat Transfer in Electronic and Microelectronic Equipment, ed. A. E. Bergles, pp. 3-39, Hemisphere Publishing Corporation.
21. NIST, 1998, Refprop, NIST Standard Reference Database 23, Ver 6.01
22. Nusselt, W. 1916. Surface Condensation of Water. Z. Ver. Ing., Vol. 60, pp. 569-575 and pp. 541-546.
23. Palm, B. and N. Tengblad, 1996, "Cooling of Electronics by Heat Pipes and Thermosyphons - a Review of Methods and Possiblities", Presented at the National Heat Transfer Conference - Houston USA, ASME HTD-Vol. 329, Vol. 7, pp. 97-108.
24. Tengblad, N. and Palm, B., 1995, "Flow Boiling and Film Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components", Proc. Eurotherm Seminar No. 45, Leuven, Belgium.
25. Tengblad, N. and Palm, B., 1996, "External Two-Phase Thermosiphons for Cooling of Electronic Components", Int. J. Microcircuits and Electronic Packaging, Vol. 19, No. 1.